Heraeus announces TF Series fluxes for chip and ball attach
Apr 21, 2006
Heraeus Contact Materials Division will show one of the industry's most comprehensive portfolios of semiconductor assembly materials including all high-performing versions of the company's new TF series of fluxes for chip attach and ball attach at SEMICON West 2006/Booth #8441, 2nd floor Final Manufacturing Hall. Assembler feedback from the field confirms TF Series fluxes are compatible with today's lead-free processes and most underfill materials on the market. Heraeus TF Series fluxes for the semiconductor market are available in No Clean, Solvent Clean, and Water Soluble versions and have outstanding print and dispense capabilities for maximum yields. In addition to TF Series fluxes, Heraeus Contact Materials Division will exhibit its advanced wafer bumping pastes, bonding wire and ribbon, SiP assembly pastes, Pb Free solder pastes, Welco fine solder powders (Type 5,6,7 and 8), and an extensive array of conductive adhesives.
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