Finetech to exhibit Fineplacer CRS 10 at NEPCON East 2006
Apr 26, 2006
Finetech Inc., has announced that it will exhibit the Fineplacer® CRS 10, a compact rework system, in booth 2001 at the upcoming NEPCON East 2006 exhibition and conference, scheduled to take place May 10 to 11, 2006, in Boston.
Finetech's complete rework station is designed specifically for customers needing a fixed configuration. Quick set up and easy operation make this machine a reliable instrument. The rework system is most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large size SMD boards. Applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components (such as 0201, 0402, 0603 and connectors), RF-shields, shielding frame, flip chip rework as well as customized applications.
The rework station features a Plug-and-Work design, eliminating the need for time-consuming cabling. Additional features include a patented Vision Alignment System (VAS) design with stationary beam splitter, controlled Z-height during reflow, a reliable rework process, proven soldering head technology, lead-free compatible rework, and an automated component place and lift-off function.
Also, Fineplacer CRS 10 is equipped with a sophisticated Controlled Mixed Soldering System (COMISS) reflow module for top heating and high-performance full-area bottom heating.