Henkel appoints Global Product Manager for Die Attach
Apr 28, 2006
The latest in a series of recent strategic personnel appointments designed to leverage the company's vast intellectual capital and further solidify its standing as the world's leading materials supplier and developer, the electronics group of Henkel today announced the promotion of Michael Buckley to Global Product Manager for Die Attach.
A 15-year industry veteran, Buckley has held a variety of development and engineering roles at several electronics industry materials firms. In these positions, he has assisted with the formulation and engineering support for conductive inks, dielectric films and leadframe die attach materials. Most recently, Buckley served as Senior Technical Service Engineer for Henkel in support of leading packaging customers' die attach processes.
Henkel's die attach product line is unique among its competitors, both for its broad range and patented chemistry advantages. The company's proprietary BMI (Bis-Maleimide) chemistry delivers increased throughput by enabling curing time efficiencies and allows adhesion to pre-plated surfaces, while its PTFE-filled pastes provide robust process advantages for stacked die applications, where fragile devices must be protected.
"When it comes to advanced semiconductor materials, Henkel's product line is superior -because of both the performance and breadth of the product range," says Buckley. "I'm very excited about my new position and look forward to continuing to deliver the outstanding products and process support customers have come to expect from Henkel."
Buckley will have complete product development, sales and technical service management responsibility for Henkel's global die attach business. In his new role, he will be based in the company's Irvine, California facility.