IPC seeks volunteers for meeting and technical conference

IPC has announced a call for participation in its 2003 Annual Meeting and Technical Conference, taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, USA.This year’s conference, entitled "Exotic Interconnections and Advanced Process Capability," will cover several key technology topics, including statistical benchmarking, RF substrates, new immersion finishes, and how multi-chip packaging offers measurable real estate savings to meet the untamed need for smaller product. The IPC is seeking individuals who are interesting in leading and organizing a technical session of five to seven speakers to present on various areas of a common theme. The session leader will use their technical expertise and knowledge of relevant topics to select presentations that will best benefit the industry. Proposals are also being solicited from individuals interested in teaching full- or half-day professional development courses on design, printed circuit board and electronic manufacturing processes and materials. Proposals and course descriptions must be submitted by May 23, 2003, and a master copy of the course workbook must be received by July 31, 2003. An honorarium will be offered to all professional development instructors. Source: PCBnewsline