Practical Components adds Amkor's PoP drop test board and kit to its repertoire
Mar 16, 2006
A leading international distributor of mechanical IC samples or "dummy" components, and SMD production tools and equipment, Practical Components announces that it has introduced Amkor Technology's award winning package on package (PoP) lead-free test board and kit.
The lead-free drop test kit and board is designed as a test vehicle for the new Amkor (PSvfBGA) 14 x 14 mm 353 ball PoP base package with 14 x 14 mm 152 ball top package.
PoP packages from Amkor Technology support high-density logic + memory device stacks, and are used in products such as feature rich cell phones, digital cameras and other mobile multimedia applications. This test board enables end users and electronic manufacturing service providers to develop and validate their stacking process and second level solder joint board level reliability.
With a three net daisy-chain pattern across both packages covering all bottom and top BGA connections through the PCB200 test board, customers have the ability to check for stacking and drop test BGA continuity, guaranteeing the integrity and durability of the process and PoP stack.
The board is designed to JEDEC Drop Test JESD22-B111 spec. Made of Polyclad 370HR 170Tg material, the board is 132 x 77 mm, by 1.0mm thick and provides via in pad and non via in pad structures on either side. Additionally, the finish is OSP Entek CU-106A-HT. Gerber data is available, and the board features 15 daisy-chain pad placements for 14 x 14 353 PoP components.