AccuPlace announces joint White Paper with Tesa on Heat Activated Film
Mar 22, 2006
The success of today's consumer electronics stands and falls with its design and functionality. The use of Heat Activated Film (HAF) offers various advantages that allow more innovative designs and functionality.
High bonding strength, the ability to bond different materials together (such as metal to plastic), and high temperature stability are some of these benefits. Whereas the material offers advantages, its placement presents some challenges: it is a rather elastic material, has no tack when cold, and needs temperatures of up to 220ÂºC for a certain time to bond. This requires a placement mechanism that can handle fragile, non-tacky materials, while offering the ability to program time, temperature, and pressure to control the bonding process.
In a White Paper Hot designs need a stronger bondâ€š, AccuPlace and Tesa jointly explain the benefits of using Heat Activated Film and how its assembly process can be automated.
For more information, please see http://www.accuplace.com/inthePress.asp or contact Guni Schiller, Marketing Manager, at Gunhild.email@example.com or Phone 954 791 1500.
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