SMT reliability the focus of Indium Corporation at Nepcon Shanghai

Indium Corporation will highlight its Reliability Program at its exhibit at Nepcon Shanghai Electronics Manufacturing Technology China on April 4-7, 2006. 

With the increasing demands for power and miniaturization driving thermal management issues, as well as SMT, CSP, and PTH Reliability, Indium Corporation is offering a comprehensive program that focuses on the products, services, and technologies to support a Process Engineer's goal of optimizing finished goods reliability. This program is customer-driven, reliability-focused, and field-proven. 

Indium's team of experts will be available at booth #2D35 to answer questions and provide information.

Indium's Reliability product exhibit will feature its award-winning NF260 No-Flow Underfill, as well as the Indium5.1 series of Pb-Free No-Clean Solder Pastes.

NF260, winner of the Global Technology Award and Vision Award, is the world's first Reworkable, Air Reflowable, and Pb-Free No-Flow Underfill. NF260 delivers increased reliability one order of magnitude over the leading competitor and two orders of magnitude over no underfill at all.