SMT reliability the focus of Indium Corporation at Nepcon Shanghai
Mar 27, 2006
Indium Corporation will highlight its Reliability Program at its exhibit at Nepcon Shanghai Electronics Manufacturing Technology China on April 4-7, 2006.
With the increasing demands for power and miniaturization driving thermal management issues, as well as SMT, CSP, and PTH Reliability, Indium Corporation is offering a comprehensive program that focuses on the products, services, and technologies to support a Process Engineer's goal of optimizing finished goods reliability. This program is customer-driven, reliability-focused, and field-proven.
Indium's team of experts will be available at booth #2D35 to answer questions and provide information.
Indium's Reliability product exhibit will feature its award-winning NF260 No-Flow Underfill, as well as the Indium5.1 series of Pb-Free No-Clean Solder Pastes.
NF260, winner of the Global Technology Award and Vision Award, is the world's first Reworkable, Air Reflowable, and Pb-Free No-Flow Underfill. NF260 delivers increased reliability one order of magnitude over the leading competitor and two orders of magnitude over no underfill at all.