Lead-free, no-clean solder pastes unveiled at APEX by Heraeus
Feb 09, 2006
A new line of state-of-the-art, lead-free no-clean solder pastes was introduced this week by the Contact Materials Division (CMD) of Heraeus during the annual APEX conference and exposition in Anaheim, California. The new line of solder pastesâ€”the F640 Seriesâ€”promotes wetting and minimizes defects with tin/silver/copper alloy soldering.
With its wide process window, the F640 Series of no-clean solder paste is able to compensate for process variations in printing, component placement and soldering. These lead-free pastes provide industry- leading wetting on a variety of surfaces and finishes and leave behind a clear residue. This reduces processing costs significantly, makes set-up easy and saves time. Offering minimal slumping and exceptional print-to-print consistency, the F640 Series can also be reflowed in air or nitrogen environments.
"The F640 series of solder paste is the latest addition to the wide array of lead-free products offered by Heraeus to the industry," said Brian Bauer, business manager for Surface Mount Materials at Heraeus CMD. "These lead-free, no-clean solder pastes were tested extensively with our customers before being offered to the marketplace. These pastes are capable of providing near defect-free performance in the ever-changing production environment where reduction of hazardous substances (RoHS) and elimination of lead from the manufacturing process are a priority," Bauer added.