APEX 2006 Product Showcase
Feb 09, 2006
Here are some of the products being showcased at APEX this week.
Asahi America - booth 1898
Asahi Technologies America will be showcasing Asahi Solder, a high-quality and high-performance line of lead-free solder materials.
Asahi Solder is certified under ISO 14000, 9001, 9002, 9003 for its commitment to the Green environment and quality. The company serves OEMs and EMSs by providing a full range of high-performance and high-quality materials. Above and beyond a material supplier, the company assists their customers in competitive direction by mitigating manufacturing disruptions and disadvantages by offering the 'Drop-in' solutions to lead-free production in the established SMT infrastructure.
Headquartered in U.S.A. and Singapore, the production and service facilities are strategically located in key regions throughout the world.
For more information, contact Asahi America, Inc. at Office@AsahiTech-USA.com
BP Microsystems to highlight 4710 with 2D vision inspection option - booth 369
BP Micro will display its latest automated option, which detects lead defects by integrating a 2D vision inspection system. The 2D vision inspection system, compatible with a high-speed camera, verifies all leads are within some tolerance before the chips are shipped to the customer. The vision system detects edge pitch, which identifies skewed leads at 0.02 mm accuracy and trend edge position, which identifies lifted leads at 0.04mm accuracy.
Used on BP Micro's automated programming systems, the 2D vision system mounts onto a tape loader and integrates with BP Win and Jobmaster. The 2D vision inspection system will be demonstrated on the 4710 automated system.
The 4710 is designed specifically for today's highest density devices and their longer programming times, making it the fastest at programming Flash, while still offering the versatility to program Microcontrollers, FPGAs, PLDs and all other device types.
The 4710 offers users numerous benefits, including:
-- The fastest programming times and unrivaled throughput means lower cost-per-device
-- Supports device densities up to 4 Gbits
-- Uses USB 2.0 communications bus
-- Programs at an unsurpassed 0.24 s/Mb
-- Programs up to 1,200 devices per hour
Creative Automation to display Champion 6809 - booth 279
Champion 6809 is a servo-driven, automated dispensing system designed for precision processes. Featuring powerful, easy-to-use proprietary software and a graphics user interface that allows for intuitive programming and control, this system can be used by even an entry-level employee, and it includes a large, bright, high-contrast color TFT display. Additionally, the Champion 6809 can be configured to match exacting application requirements from dots to underfills with a broad array of options. Placement accuarcy of this system is within 3 ├â???m, but features placement capabilities that are designed for anticpated accuracy demands that have not yet occurred.
The Digital Dispensing process achieves the highest levels of accuracy, speed and repeatability available today. Made for nanodispensing, the Champion 6809 dispenses dot diameters down to 0.003" with bead width down to 0.003" as well. Volumes are below 0.5 nanoliters. Additionally, the system features a dispense area of 5.5 x 12.0", and a resolution and repeatability of +/-0.00008" (2 ┬Ám) for all axis. The closest competitor in this market can dispense at only 1/10 of the prescision of this machine. This machine has solved many of the requirements found in the medical electronics sector that require exacting specifications.
Everett Charles Technologies to showcase Eliminator 6 at APEX 2006
A pre-screener, or turbo charger of sorts, for industry accepted flying probe test (FPT) systems, the test system eliminates test points needing to be tested by FPT. E6 leverages FPT advantages of fixtureless, quick test preparation and programming, while overcoming FPT's historical weakness - slow test times per PCB - to make FPT (as part of the Eliminator Test Cell) suitable for high-volume production electrical test, as well as prototype and all volumes in between. Panel test application niches addressed by the E6 are rigid PCB, I/C package, and PCB inner layers (in development), making the E6 a versatile test tool.
Eliminator 6 scans PCB panels at a rate of up to 76.2 mm (3")/second regardless of PCB density, test pad size and pitch, or number of PCB images per panel, providing users with improved speed and throughput rates. Typical resulting elimination rates of 85-92 percent per panel permits FPT test times of less than 2 minutes per panel. For example, a specific I/C package panel tested on an atg A6/16 FPT took 70 minutes and 16 seconds. After the E6 eliminations, that same panel tested complete in 15 minutes and 21 seconds. This equates to a 78 percent reduction in FPT test time and still with no test tooling cost.
E6 provides numerous cost benefits, the most significant savings being the elimination of expensive test tooling and fixturing, especially for the most complex circuits. This savings includes the specific fixture material cost, assembly direct labor, related overhead and storage expenses associated with fixture tools. On a prober centric test floor, one Eliminator effectively increases the throughput for each of several FPT by 3 to 4X. This significantly increases test capacity with a minimum of capital outlay.
KIC to showcase lead-free thermal process kit - booth 363
The kit is comprised of the SlimKIC 2000, Auto-Focus oven recipe search engine, metal shield, higher temperature thermocouples (TCs) and aluminum tape. The new kit enables manufacturers to set up and manage their lead-free thermal processes.
The brand new metal thermal shield offers significantly better thermal protection while keeping the slim physical dimension of the "cool touch" shield. Some manufacturers process their parts in an inert atmosphere, requiring a tighter tunnel height. A low height thermal shield becomes imperative for such applications. The KIC Auto-Focus acts as an "oven recipe search engine" and automatically recommends the appropriate oven recipe for any lead-free application before even running a profile.
Medium-temperature TCs rated to 400oC as well as aluminum tape for easy TC attachment round off this specialty kit.
Kyzen to highlight A4615 - booth 1401
A4615 is a low VOC aqueous blend designed for optimum effectiveness on pastes, tacky fluxes, rosin flux, no-clean flux, lead-free flux and assembly residues while being people-safe and environmentally friendly.
The concentrated cleaner contains a blend of organic solvents, non-ionic surfactants, alkalinity builders, and organic and inorganic inhibitors in a water base. It can be used in spray-in-air inline and batch washers, immersion agitation, or ultrasonic systems. It also may be used in stencil cleaning systems or manual applications for the removal of virtually all types of pastes and fluxes.
A4615 is the only SCAQMD approved product that is effective at 25 g/l operating conditions. The material offers users numerous benefits, including brilliant solder joints, low foaming, multi-metal safe, RoHS compliant, no HAPs, non-flammable, low use cost and long bath life.
MVP to highlight wire bond inspection capabilities - booth 2493
MVP is expanding its current capabilities to include the application of wire bond. "We are very excited to offer this new affordable option of wire bond automated optical inspection by leveraging the same capabilities and tools offered by our standard MVP AOI software," said Dr. George Ayoub, President and CEO of MVP. "This will expand our product line beyond component assembly and paste inspection, enabling MVP to offer a competitive product for the packaging industry."
Defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry, and contamination can easily be detected using the wire bond inspection configuration.
The wire bond configuration is available as an option on MVP systems. For more information, contact the company at (760) 438-1138 or firstname.lastname@example.org.
Promation to Exhibit PRO 1S and PRO 1Sm Mini Wave Systems - booth 915
The PRO 1S and PRO 1Sm are single nozzle, selective soldering stations that incorporate a variety of technologies to easily solder individual or groups of components. The nozzle is surrounded by a nitrogen blanket to enhance the soldering process.
The 30 lb solder pot is lead-free compliant and comes standard with a solder replenishment system and automatic spray fluxer system. PCBs or pallets enter the work cell on a precision in-line conveyor system. Programs may be easily set up through the use of Promation's data management system or overhead laser pointer. Once the X/Y parameters are established, the Z motion may be used to maneuver around bottom side components. For more information about the PRO 1S please contact your local sales representative.
Surclean to highlight SMT USC400
The SMT USC400 is a highly portable ultrasonic contact type stencil cleaning system. In use, the operator moves the hand tool over the stencil after spraying with cleaning fluid. The tranducer in the hand tool vibrates the contamination through even the smallest stencil apertures. The residues are collected on disposable wipe material under the stencil. The SMT USC400 excels in removing difficult high tack residues such as those found with lead-free solder materials. Direct contact ultrasonic cleaning is the most effective way to remove lead-free solder paste residues from fine-pitch stencils.
The SMT USC400 is suitable for both offline and on-printer cleaning operations. Additionally, stencil cleaning can be carried out on the printer without removing the stencil frame. Because the USC400 is highly portable, it can be easily moved between work areas or Printers.
An optional ultrasonic mini-bath is available, which extends the versatility by allowing cleaning of machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
The SMT USC400 offers users numerous benefits, including the following features: lightweight for workplace portability, rugged industrial construction for long service life and is suitable for all stencil materials, even plastic. The systems offers no risk of damage to delicate stencils and is suitable for cleaning all printable materials, including paste, inks, resists and SMD adhesives. Also, an Advanced Transducer Autotuning system results in optimum cleaning performance on all applications.
Further benefits of the SMT USC400 include minimal use of cleaning fluids, lower cost and less VOCs. The system is versatile because it ban be used on- or off-line, and cleans both machine accessories and nozzles. Additionally, the SMT USC400 is portable - users can take the cleaning system to the job.
The SMT USC400 results in improved process yields, particularly on fine-pitch applications. As an optimum stencil cleaning solution for lead-free processes, the system is affordable, offering a low acquisition cost, and offers users simple operation that requires no operator setting. As a further advantage, the system is safe - a low voltage, high-efficiency transducer drive circuitry is standard on the SMT USC400.
Tamura to showcase FLIP - booth 1251
FLIP Solder Bath for Lead-free reflow soldering solutions features Linear Induction Pumping Technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming's left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two Induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in both reflow and selective solder systems, the FLIP is one of its kind.
Additionally, the FLIP Solder Bath features numerous advantages over other solder bath systems, including less solder used: only 300 kg, instead of 450 kg and less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. This results in less waste to eliminate making this device not only environmentally efficient but also saves a significant time saver as well not having to stop the machine as often to empty the dross. This feature also uses one third less solder so a significant cost savings is realized. Also, it offers significant ease of maintenance - Open space to access inside side bath and easier nozzle cleaning and maintenance. Improved machine reliability and up time is realized - No motors, impeller shafts or belts. It also features a quieter and more stable solder wave than impeller motor types. Because of this, the product is safer for the operator to use. Acid oxidization around the motor spindle is eliminated and a quicker response results.
The patent-pending technology offers users multiple advantages, including the following: the solder bath uses 30 percent less initial solder to operate because it features a smaller solder bath than conventional systems; and the solder bath generates 40 percent less solder dross after eight hours of operation than conventional motor-driven solder baths.
VJ Electronix to Highlight Summit 1800A Rework Station at APEX 2006
VJ Electronix's Summit 1800 Rework system provides some of the most advanced features designed specifically to address the most difficult rework challenges, including lead-free rework for large components. An increased 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets and connectors. The addition of programmable, motor-controlled top heater positioning in conjunction with the Summit's independent pick-up motion provides the ultimate in process flexibility, the number one choice for many contract manufacturers.
The Summit 1800A adds a motor controlled board support table to the many standard benefits of the leading lead free rework system. The new table facilities automated, hands free site scavenging. It also supports automated alignment and further reduces operator intervention. Various options are available for the Summit 1800A, which include component print station, cooling boost, sliding board support, 17" LCD monitor and 22 x 30" board size upgrade.
VJ Electronix's Windows-based SierraMate 7.0 software improves on the Summit's industry-proven simple operation and process control. New Advanced Auto Profile with rules-based process development allow process engineers to set specific constraints to be applied during automatic profile generation. This is a significant benefit for lead-free processes.
An automatic prism shuttle designed to accommodate large components facilitates accurate and repeatable component alignment. The system simultaneously looks up at the component and down at the board, providing a composite alignment view. The digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a simple click on the graphical user interface.
BP Microsystems - Booth 369
BP Microsystems will highlight its latest manual programming systems, which feature USB 2.0 and support for in-circuit programming, at APEX 2006.
BP Micro will showcase its full line of manual device programmers, which now feature high-speed USB 2.0 standard bus for improved communication speed and provide in-circuit programming solutions by using the new ISP-PRO socket module.
While known worldwide for off-line programming, BP Micro now has the capability and experience of providing in-circuit programming solutions using its single-site engineering and multi-site concurrent programmers. The programmer can be connected to the board via a cable interface using the robust and production-ready ISP-PRO socket module.
BP Micro's manual programmers can be connected to the board via a cable interface using the robust and production-ready ISP-PRO socket module.
After programming the device in-circuit, the user can verify the functionality of the device to determine if it works correctly in the end application. If the user should encounter problems with the device, then the board can be programmed on the programmer. This allows the flexibility to rerun or rework boards as needed.
Creative Automation Co. - Booth 279
Creative Automation Company will introduce its True Volume Piston Positive Displacement Pump, which is a digital dispensing system that uses Creative's patented technology to offer the most accurate volume control available in the fluid dispensing industry.
True Volume pumps maintain accuracy in the most demanding circimstances. Changes in temperature, viscosity or deposit size will not impact the accuracy or speed of the True Volume pump.
The Pump's technology uses a piston that moves within the dispensing chamber to deliver an exact amount of fluid through the tip. The True Volume Pump delivers true piston positive displacement dispensing with no delay for refill and with unrivaled accuracy.
The True Volume Pump family includes models designed for all applications. The lightweight version (SP-2) is perfect for applications requiring multiple dispense heads. Standard models are built in stainless steel while models for abrasive materials use tungsten and Delrin materials for wetted parts.
Patented tips and pistons are available for single shot volumes ranging from 0.01 to 274 microliters.
Digitaltest - Booth 1351
Digitaltest will showcase among other products the second generation Flying Prober Condor 500.
The Condor 500 Flying Prober is now available, with its unique drive technology via linear motors, which ensures both high speed as well as high accuracy (Fine Pitch). The new platform is now 30% faster, 25% less expensive and comes with a unique brand new 'Soft Landing' tool and optional integrated Boundary-Scan. The new pricing makes Condor even more affordable.
Digitaltest's comprehensive software allows fast test program development directly from CAD data and parts-lists. Off-line simulation, panels and different versions of PC-Boards are also supported. The test electronics allows In-Circuit and Functional Test, Opens Check, Memory Test/and Programming, Boundary-Scan and Vision.
The unique implementation of Boundary-Scan allows the heads and further pins to be driven parallel to Boundary-Scan, which enables an increase in test coverage while reducing the test time. The net test method ensures a 3 to 5 times higher throughput in production over conventional Flying Prober systems. The software is rounded off with an integrated quality management tool, QMAN.
Elektrobit - Booth 1117
Elektrobit Group Plc. will be exhibiting a wide range of automation equipment at APEX (8-10 February 2006) in Anaheim. The focus at APEX will be a JOT Automation line, featuring a Bare Board Unstacker, a Laser Marker, and a Single Magazine Handler.
The J210-50 Bare Board Unstacker automatically feeds boards onto a production line and has a pass-through length of just 500mm (19.7"). The track height is adjustable from 750-1000mm (29.5"-39.4"), while a support mechanism relieves the load on the boards at the bottom of the stack.
The J502-22 Laser Marker is being shown in the US for the first time, having been premiered at Productronica in November. The YAG 1064nm laser can mark barcodes, 2D codes, text and graphics at up to 100 characters per second and it has a PCB transfer cycle time of just six seconds. Despite its small footprint, it offers a marking area of 100 x 100mm within a generous working area of 470 x 470mm.
The J215-33 Single Magazine Handler is ideal for high-mix, low-volume production and at APEX will feature a feed-out conveyor for unloading.
The J401-11 'Tiny' Test Handler will also be receiving its US launch, shown in conjunction with new display tester software, able to test small LCD displays, keyboards and housings of electronics equipment.
Also on display will be the J501-41 Stand Alone Mini-Router, a cost-efficient stand alone desktop router for topside routing. Its small footprint offers flexibility for accurate, clean-cut routing in a range of production applications.
ESSEMTEC - Booth 2433
ESSEMTEC AG, will highlight CDS6250, a nanojet dispensing system for adhesives, oil and lubricants.
CDS6250 is an automatic dispensing system that can dispense up to 150 drops per second (540,000 drops per hour). The Nanojet dispensing valve produces the smallest dots, down to 2 nl. The three-axis dispensing system is easily programmable, and it offers remarkable advantages in many applications in the electronics, mechanical and medical industries.
The jet dispensing system can dispense a wide range of applications, including adhesives with and without filler, pastes, oils, lubricants, colors, lacquer, flux, solder resist, conformal coating and more. Almost all media with a viscosity between 50 and 200,000 mPas can be dispensed.
Remarkable cost and time savings can be achieved in applications where the substrate is curved or bent. Other advantages include the jet valve's speed and precision as well as its capability to produce very small dots. Even very thin ropes can be dispensed by jetting one drop next to the other, or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) at high temperatures up to 100┬░C.
Finetech - Booth 1481
Finetech Inc., announces that it will highlight the Fineplacer┬«? Micro HVR system at APEX 2006.
The industry award-winning Micro HVR is uniquely designed to address the new high-volume rework market where hundreds of boards must be repaired due either to high value, component scarcity or where manual rework is illogical.
For repair challenges arising from component failure, assembly error, device revision and firmware updates, the system automatically sequences the repair steps: component (including shield cans) de-solder and discard, residual solder removal, flux dispense (where necessary), and component re-solder. All steps are performed without operator intervention, resulting in a precise, high-yield process.
Micro HVR offers users numerous benefits including closed-loop force control for placement during reflow, a stable and reliable process, and an automatic tool exchange. Also, the system features an open data interface structure to the assembly line, and a modular and flexible design that is adaptable for different applications.
This "lead-free" capable system can be configured with solder paste dispense for today's challenging 0201 devices, where exact placement and precisely-directed air flow prevent component disturbance in densely-populated areas.
Juki Automation Systems - Booth 1069
Juki Automation Systems, a world-leading provider of automated assembly products and systems, will exhibit the Juki 300 High Value Selective Soldering System.
The Juki 300 is part of a line of Selective Soldering Systems designed to meet the demands of a rapidly changing electronics manufacturing industry. The system is compatible with both lead and lead-free alloys, and offers high reliability and industry-leading service and support features.
The Juki 300 is a complete, high-level package ready for lead-free production. It comes fully equipped with all of the functionality necessary to begin production immediately. The system includes a soldering unit with nitrogen inertion at the mini-wave. Nitrogen inertion limits dross build up, opening the process window and reducing maintenance. An innovative nitrogen management system is used to reduce nitrogen consumption.
The Juki 300 is backed by over 13 years of Selective Soldering engineering experience and technical know how and supported by an extensive and highly trained service group.
Juki will also exhibit the CX-1 Advanced Placement System. The CX-1 is an innovative advanced placement system that is capable of placing advanced packages and features high-accuracy applications as well as standard SMT. The CX-1 is capable of placing SiP, MCM and other mixed-technology applications.
With the highest placement accuracy and lowest cost of ownership, the placement machine offers fast throughput for SMT (exceeding typical speed/throughput of competitive placement systems). Additionally, the CX-1 is compatible with existing feeders and line control software (HLC). The system is based on proven technologies and is said to be more economical than dedicated machines.
KIC - Booth 363
KIC will highlight its Global Technology Award Winning system at APEX 2006
KIC's 24/7 Process Monitoring brings an innovative level of automation to the thermal process: Automatic profiling of each and every product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. The real-time process data enables engineers and managers to make crucial cost containment and quality control decisions, thereby improving overall quality and consistency of performance, as well as providing significant cost benefits to users.
The KIC 24/7 automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process.
KIC has creatively applied its separate monitoring technologies into this new, single process monitoring system in order to advance the thermal process, which is a very significant challenge in today's industry.
Lloyd Doyle - Booth 2086
Lloyd Doyle has announced that the IBIS system, a brand new development for solder bump inspection, will be on display within the Innovative Technology Showcase at the upcoming APEX 2006 trade show and exhibition.
IBIS, the Interferometric Bump Inspection System, uses emerging technology to offer production volume solder bump inspection on chip carriers. It is designed to inspect and report on the position, height and shape of solder bumps on the die-attach side of chip carriers, ensuring that the carriers are within specification for chip attachment.
IBIS uses massively parallel digital signal processing technology coupled with true white light interferometry to offer 20 to 30 times improvement over existing interferometry systems previously available. Lloyd Doyle's proprietary enhancements give IBIS the edge for solder bump height measurement. This enabling technology will be transportable to wafer and chip solder bump measurement in the future.
MVP - Booth 2493
Machine Vision Products (MVP) will premiere the new Ultra 850G Automated Optical Inspection System at the APEX tradeshow and exhibition.
MVP introduces the latest in a series of flexible, powerful solutions to the marketplace with the Ultra 850G.
"With this new product introduction, MVP broadens its solution offerings to the packaging industry," states Dr. George Ayoub, President and CEO of MVP. "We are excited about the opportunities in inspection and measurement in this new marketplace."
A granite-based stage gives accuracy of inspection to 10 ┬Ám. The AOI system is the ideal platform for metrology-based applications, as well as a wider range of capabilities, in which precision measurement is key to the inspection process.
The Ultra 850G has the capability to be configured for a number of applications, including die placement, wire bond, paste inspection, and pre- and post-reflow inspection. MVP has the ability to adapt the electro-optics of the system by applying flying color technology, true color technology or standard grayscale technology as required by the inspection criteria. With its multiple field of view options, MVP's new Ultra 850G is the machine of choice for high-inspection applications.
PROMATION - Booth 915
Promation, specializing in PCB Handling Equipment, Selective Robotic Soldering, Laser Mark and Technical Workstations, will highlight the PRO-8b Selective Laser Soldering system at APEX 2006.
This enhanced work cell provides an economical means to selective solder both tin/lead and lead-free alloys within minimal startup costs and ongoing maintenance, lower power consumption, and reduced environmental impact.
This 60 W Diode Laser Cell in-line soldering station combines superior performance, easy-to-use software and precision movement to selective solder most bottom-side applications.
The Laser also offers over 10,000 hours of useful soldering life and does not require that the solder remain preheated during non-soldering times, which greatly saves on facility costs.
Seica Inc- Booth 2257
Seica will showcase its innovative PILOT VIP Flying Probe system, a full-performance test system that integrates a complete set of test tools and techniques that go beyond the conventional definition of "flying prober".
It is another product in Seica's portfolio of automated test solutions, and includes a SMEMA conveyor, which is completely user-programmable to suit various manufacturing/test process layouts. The system includes the hardware and software features of Seica's unique VIVA Integrated Platform (VIP), and can be fully loaded to cover the full range of in-circuit and functional test as well as providing additional capabilities such as AOI Inspection, Boundary-scan and On-board programming.
Seica has extended its range of solutions for the electronics industry to include Firefly, another automated product designed to meet the increasing need for automatic selective soldering, using the power of laser technology. Firefly is also based on Seica's VIVA Integrated Platform, offering all of the advantages of the simple, three step process for generating, verifying and running a soldering program, plus a multitude of additional software tools that can be used to further optimize system flexibility and performance.
Seica will also be showing the Valid, a full-performance functional test system, and Strategy.tk, the "size small" test solution for crowded manufacturing environments and cost conscious investment.
Siemens - Booth 443
Siemens Energy & Automation, Inc., Electronics Assembly Systems Division will feature its SIPLACE X-Series representing maximum speed with extreme precision at APEX 2006.
The Siplace X-Series allows customers to configure exactly the amount of capacity they need with two, three or four gantries. The Siplace X-Series has a newly developed 20-segment Collect & Place head and each head can achieve a placement rate of up to 20,000 cph with an accuracy of 55 ├é?m at 4 sigma for a total of up to 80,000 cph on a single machine. Additionally the 20-nozzle Collect & Place head can handle 90 percent of all components on the market today, particularly in high-speed environments. It can place components ranging from 01005s to components 6 x 6 mm large.
Another highlight of the 20-nozzle Collect & Place head is the integrated component sensor mounted directly at the head's pickup and placement position. This system prevents errors and guarantees a high level of placement quality especially with the smallest components like 0201s.
VJ Electronix - Booth 2265
VJ Electronix Inc., will display the Summit 750LF advanced rework system in booth 2265.
The VJ Electronix Summit 750LF Rework System was developed specifically to meet the needs of users who demand high-performance and advanced process control at an affordable price.
The 750LF incorporates proven features for greater control of elevated thermal profiles required by lead free alloys. Top Heater Cooling Boost accelerates the downward ramp from peak temperature to maintain profiles within strict time over liquidus constraints. Active Component Cooling Control helps protect thermally sensitive components. Top Heater High Low Flow control optimizes the top heater for both large and small devices.
The Summit 750LF system ensures complete rework capabilities for ball grid array (BGA) and quad flat pack (QFP) components. Based on the company's long established Summit series of rework systems, the VJ Electronix industrial grade design provides superior stability, ease of use and repeatability.
VJ Electronix Inc., will also display its Model 1550 fully automated X-ray inspection system. Designed specifically for the manufacturing floor, X1550 features large board X-ray inspection with automated motion control, measurement and analysis.
Additional characteristics include advanced solid-state detector-based inspection for lead-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface. X1550 is low maintenance, and requires minimum operator intervention with maximum automated analysis.
X-Tek - Booth 463
X-Tek Systems, one of the world's leading manufacturers of real-time microfocus x-ray systems, will be demonstrating the latest software and hardware advances to its Revolution x-ray inspection system at APEX this year.
Getting its US premiere is the new NanotechTM source offering improved defect detection thanks to feature recognition in the nanometer range. The Revolution offers a greater degree of inspection than any comparable system with a viewing angle of up to 75o, just 15o to the plane of the board.
This combination allows for maximum magnification (up to 6000x) at all angles over the entire 16" x 16" (410mm x 410mm) manipulator scan area, for 100% BGA, ┬ÁBGA, multilayer board and PCB solder joint inspection, with quick analysis of BGA ball wetting, attachment, cracks and delaminations.
X-Tek's unique 160XI cable-free open x-ray tube offers true NanotechTM resolution in an extremely stable and low-maintenance format, with quick-change extended life filaments.
The system also features a new PCB programming interface for the user-friendly InspectX software, designed to streamline programming requirements, as well as automatic BGA software.
Assembleon - Booth 2117
Assembleon further extends its advanced M-Series range of mid- to high-volume SMD placers with the new MG-2 chipshooter, which will be launched at Apex 2006.
The MG-2 provides the ultimate in high-speed, high-mix, high-accuracy production for applications such as automotive, memory boards and PC peripherals. It can be used standalone to deliver chipshooting speeds up to 40k cph at lowest cost per placement. Or it can be used alongside the MG-1 and/or MG-8 multifunctional machines to boost line performance in applications requiring additional chipshooting capacity.
The MG-2 features a high-precision dual-gantry system carrying four beams, each with six heads. It places components from 01005 to CSP, BGA, PLCC and QFP with a maximum size of 14mm2, with placing accuracy of 50 micron at 3 sigma for chips.
Benefits of the MG-2 include a small footprint and functional flexibility within the M-Series range. The MG-2 uses the same user interface, feeders, feeder trolleys and spare parts as the MG-1 and MG-8. In fact, the M-Series machines use the same interface and feeders as their counterparts in the GEM XII range, providing a cost-effective upgrade opportunity for existing Assembleon users.
For further information visit www.assembleon.com
AVANTEC Performance Chemicals - Booth 613
Avantec recently finished its participation in the EFSOT (Environmental Friendly Soldering Technology) project, in partnership with European and Asian companies. Avantec was the only solder paste manufacturer developing SnAgCu alloy based solder pastes using class 3 SAC powders and producing new organic part formulations to fulfill the various industrial partners' solder joint and production needs.
The outcome of this was portrayed in the development of EcorelTM Easy 305 and 405 solder pastes yielding excellent results at fine pitch assemblies aligned with the RoHS directive which also answer the demands of current and future needs of the Electronic industry.
More information can be found at: www.efsot-europe.info.
Bliss Industries - Booth 857
Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, will release its new Vertical PC Board Cart at APEX.
This cart is available in a variety of standard sizes, and is infinitely adjustable. It offers custom slotted ESD-safe plastic panels on the shelves to fully protect the edges of PC boards and the sheet metal panels attached to high-end PC boards. The panels feature a "fish mouth" entrance to the slot to make it easy for the operator to slide PC boards into the shelf. The carts are available for single-sided applications as well as double-sided. Hundreds of PC boards can be stored in this new style cart, and fully enclosed models are available.
"Many of our customers in the medical products and the high-end communications market asked us to create a Bliss solution for storing and handling large, high-end boards that cannot be laid down flat in our trays. Once again, we have exceeded the customers' expectations and created a new industry standard," said Ken Bliss President and CEO of Bliss Industries.
Bliss Industries will also launch its family of Chassis Carts. These carts are the ideal solution for 19" chassis handling for box build. The carts offer fully adjustable rails to fit all chassis sizes. Bliss also offers an open-top cart design to accommodate vacuum lift heads to place chassis in and out of the cart.
Also available is Bliss ESD Softsurface material on the top, bottom and side of the rails, and front vertical post edges of the cart. This completely protects the chassis from scratches and dents during handling. The cart can hold up to 1,000 lb.
In addition, the company will display BlissLift. A lift in itself is not news - however, the BlissLift is news because of some key features new to the lift industry. The lift features a patent pending, easily adjustable leg assembly. No tools required and it takes only about 30 seconds to make an adjustment.
The BlissLift makes it easy to move large heavy PC boards, backplanes, PC board magazines, totes, bins and is ideal for chassis handing.
"The BlissLift took far longer to develop than any previous product, but it was worth it," said Ken Bliss President and CEO Bliss Industries. "We have delivered to the industry a complete solution for lifting and moving items around a factory, quickly and efficiently. We plan to utilize this patent pending technology to access other markets as we expand our market base in line with our business plan for the next few years.
Cogiscan - Booth 1063/2443
Cogiscan will introduce its revolutionary concept in offline feeder storage.
The Cogiscan RFID Smart Feeder Cart expands the concept of intelligent feeders from SMT placement machines and feeder banks to storage carts.
This new product will be demonstrated at two different locations during APEX:
#1063 : Cogiscan
#2443 : Hover-Davis (Cogiscan technology partner)
Track feeders and components offline.
Provide real-time inventory.
Eliminate human intervention.
Eliminate bar code scanning.
Reduce waste of time and materials.
The Cogiscan RFID Smart Feeder Cart system can be used in combination with Cogiscan software applications (Line Set-up Control, Traceability, Inventory Tracking, etc.) or alternatively, with third-party software applications. It can also enhance existing systems by eliminating manual barcode scanning.
ESSEMTEC - Booth 2433
ESSEMTEC AG, will display SP200-AV, a fine-pitch printer with automatic vision adjustment, at APEX 2006.
Solder paste printing is a significant process step in the SMT production chain. Bad quality produced at this step cannot be corrected later, neither by the pick-and-place machine nor by the reflow oven. Therefore, the quality and reproducibility of the printing operation is very important.
The stencil printer SP200-AV is an easy-to-operate semiautomatic printing machine that controls and regulates all printing parameters. The only manual task is to slide the PCB into the machine. All other operations, including the positioning of the PCB, are fully automatic and reproducible.
SP200-AV offers users numerous benefits including a fast two-point vision system, automatic PCB positioning with vision, automatic printing process, automatic stencil cleanliness check and fast PCB loading with side drawer. Additionally, the printer provides an unlimited number of printing programs, an integrated operation manual, simple changeover between jobs and easy operation with Windows XP software. As an additional benefit, all printing parameters are programmable.
Also on display will be WS330, a professional wave soldering machine for the production of small and midsize batches. WS330 is a compact, professional wave soldering machine for small and midsize volumes in standard and lead-free technologies. The solder width of up to 330 mm (13") and the universal pallet transport system allow users to work with a large variety of PCBs. The system also is equipped with a dual-wave technology, allowing both THT and SMT components to be soldered.
Finetech - Booth 1481
Finetech Inc., announces that it will highlight the Fineplacer┬«: CRS 10, a compact rework system, at the upcoming APEX 2006 trade show and exhibition.
Finetech's complete rework station is designed specifically for customers needing a fixed configuration. Quick set up and easy operation make this machine a reliable instrument. The rework system is most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large size SMD boards.
Applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components (such as 0201, 0402, 0603 and connectors), RF-shields, shielding frame, flip chip rework as well as customized applications.
The rework station features a Plug-and-Work design, eliminating the need for time-consuming cabling.
Very high accuracy (better than 10 ┬Ám placement accuracy) allows the system to be used for the smallest components with pitches down to 100 ┬Ám. On the other hand, the large field of view makes it possible to align large components, e.g., Super BGAs with side lengths of up to 45 mm, without additional optics.
Finetech will also highlight the versatile Fineplacer┬«: Pico system, FINETECH's most versatile base module.
It can be used in a wide field of applications for reflow/rework and different kinds of micro assembly, e.g. Flip Chip bonding. On one hand, the Pico for micro assembly offers the highest accuracy of 5 ┬Ám (0.2 mil) placement accuracy, allowing the smallest die with a pitch down to 50 ┬Ám to be bonded. On the other hand, the Pico rework configuration offers enough accessibility to be used for nearly all large standard surface mounted components.
Humiseal / Concoat - Booth 900
APEX 2006 will see the North American launch of the HumiSeal UV40 range, where Concoat Limited personnel will be available to discuss the significant advancements they have made in the field of UV curable conformal coating materials.
Concoat personnel will also be available to discuss their unique range of water-based coatings, designed to be friendly to the environment and to protect electronics assemblies at temperature extremes far beyond that of existing resin-based alternatives.
HumiSeal UV40 is easy to process and wont "crack" under thermal cycling, offering manufacturers a genuine alternative with none of the problems normally associated with these materials.
For the first time, high volume users in fields such as automotive and consumer electronics can gain access to the popular UV curable coating class (because of its rapid cure speed) with a level of processing ease and thermal cycling resistance never before achieved with UV materials.
"We are very proud of the performance we have managed to achieve with this new product family," comments Phil Kinner, Chief Chemist at Concoat, who was the technical driving force behind the development of HumiSeal UV40.
One of the key benefits of the new UV material is its low viscosity. "This dramatically eases processing challenges in terms of being able to uniformly and quickly coat a board and ensure the coating spreads over all required areas," says Kinner."
Indium Corporation - Booth 433
Indium Corporation of America's exhibit will feature advanced technologies in Pb-Free electronics assembly with cutting edge materials. This includes Indium's award-winning NF260 No-Flow Underfill, as well as its new 5.1 Series of Pb-Free No-Clean Solder Pastes.
NF260, winner of the Global Technology Award, is the world's first Reworkable, Air Reflowable, Pb-Free No-Flow Underfill. It is designed for Chip Scale Packaging (CSP) and BGA or Flip-Chip assemblies using a single reflow process. NF260 offers both a fluxing and underfilling capability for the chip while providing increased reliability and environmental protection.
The Indium 5.1 series of Pb-Free No-Clean Solder Pastes features:
Industry leading "response-to-pause" printability
Excellent wetting to all common Pb-Free metallizations
Low voiding across a wide variety of reflow profiles
Unsurpassed print transfer efficiency through small apertures
Kester - Booth 1085
Kester will provide numerous lead-free resources, technologies and products at the APEX trade show and exhibition.
Kester will be featuring numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006 RoHS Directive deadline. Among products being featured are EnviroMark 907 lead-free no-clean paste and its low-cost Ultrapure´âó K100 lead-free bar solder alloy, along with Kester's technical services to help manufacturers assemble lead-free. As an additional resource, Kester's new interconnecting materials catalog featuring its entire lead-free line will be debuted at APEX.
Kester is also proud to sponsor the most practical Lead-free RoHS Information Sessions at APEX. Its Lead-Free RoHS Information Center will feature five must-hear lead-free sessions with key industry leaders speaking from Kester, Vitronics Soltec, OK International, MacDermid and Fischer Technology Inc.
Kester will also showcase EnviroMark 907 (EM907) - a new no-clean, lead-free solder paste to the electronics industry.
Kester's EM907 No-Clean Lead-Free Solder Paste is designed to exceed customers' expectations for high-yield lead-free manufacturing. EM907 is a newly engineered product specifically for the higher thermal demands of assembling with higher melting temperature lead-free alloys, such as the family of SnAgCu (SAC) alloys.
As always, Kester's global lead-free team of technical engineers will be present to answer all lead-free questions that companies may have about lead-free assembly. Be sure to stop by booth 1085 for more information.
KIC - Booth 363
KIC will display the updated version Wave Surfer, a wave application fixture, in booth 363 at the upcoming APEX 2006 trade show and exhibition.
Wave Surfer is an easy-to-use, self-contained measurement system for wave solder machines that provides critical data on wave solder machine setup and its process.
As a wave solder machine profile fixture, Wave Surfer has five embedded thermocouples, and works in conjunction with the SlimKIC 2000 for quick and easy profiling and setup.
Made of a material similar to typical wave solder pallets, the Wave Surfer can withstand thousands of passes. The fixture holds the SlimKIC in place during each run to measure the pertinent process data in the wave solder machine including peak temperature, dwell time, parallelism, and conveyor speed.
The KIC Wave Surfer joins a host of recent KIC introductions that have enabled the transition of the powerful and easy to use SlimKIC 2000 from primarily a reflow tool to a universal thermal process tool that covers other applications such as cure, rework and wave solder.
Novatec - Booth
Novatec, a key research laboratory that develops new technologies for the electronics assembly industry, will display an innovative new assembly tool for board support - VacuNest Shape Memory Tooling at the upcoming APEX 2006 trade show and exhibition.
Board support is critical within any printer, dispenser and pick-and-place machine in order to run a repeatable process.
VacuNest shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules.
Simply place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ´éż on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will be held for weeks/days/months until the vacuum is released, whereupon the modules return to their original form, awaiting a new set up for the next version of board.
VacuNest offers users numerous advantages, including no risk damage to a component due to the pin/printing pressure, the support forces are evenly spread over the entire board, the tooling provides firm and precise support, ease of use, no dedicated tooling and short payback period, and the shape tool can be simply reset when a board version changes.
Additionally, this flexible tooling features many cost benefits. Several VacuNest systems are already in use in France, Germany and the United States.
For more information on VacuNest, visit the company at www.novatec-eap.com.
OK International - booth 815
OK International will launch its MFR Series -Multi Function Rework System at APEX 2006. Utilizing its powerful 'Smartheat' technology, the system is said to meet all of today's lead-free soldering challenges.
With a single bench-top unit even the most complex electronics assemblies can now be soldered, desoldered and reworked using a comprehensive array of tools that set a new standard for flexibility, capability, reliability and value.
The MFR Series - Multi Function Rework System has a compact power unit which offers two ports to which any of the MFR Series tools can be attached quickly and easily for rework applications, SMT tasks and through-hole soldering and desoldering. For heavier or more varied workloads, multiple units can be interlocked to power as many tools as necessary.
The MFR Series offers a choice of heater tips or tip cartridges. The heater tips are designed to provide a cost-effective option to meet the demands of point to point production soldering; while tip cartridges are suitable for high performance soldering and rework applications.
Siemens - booth 443
The Siemens SIPLACE Platform - Innovation leadership through seamless interaction of hardware, software and services
At APEX 2006 the Siemens SIPLACE placement machines will once again prove their advantage and demonstrate that they provide the best foundation for optimized and maximum efficiency in electronics manufacturing.
The modular SIPLACE platform - which ranges from the SIPLACE Compact Series, preferred by the mid-range market, to the SIPLACE X-Series, which is capable of reliably placing even 01005 components - provides maximum investment protection. Siemens focuses on real-life applications on innovative line configurations with SIPLACE equipment, ranging from the "Extreme Performance Line" to the "Extreme Flexibility Line". Equipped with features like the Productivity Lift, the Dual Conveyor System and intelligent software, the SIPLACE team demonstrates how its lines can be adapted to changing requirements within the shortest period of time.
Switching out hardware was yesterday. Today, product changeovers are accomplished more efficiently via software and data management. SIPLACE software is easy to operate and expertly controls and synchronizes machines and lines. It not only maximizes your throughput and machine utilization, it guarantees it and provides critical benefits in terms of productivity, reliability and traceability.
Siplace services help electronics manufacturers to improve their overall line efficiency with customized packages. And the global SIPLACE service network, with 90 company locations makes sure that it stays that way for the life of the SIPLACE machines at predictable terms and without unpleasant surprises.
Speedline Technolgies - Booth 1207
Coming off a highly successful global launch at Productronica in November, the VectraElite soldering system makes its North American debut at this year's Apex show.
As the next generation of Vectra, the VectraElite expands upon the proven core subsystems of Speedline's Vectra wave soldering system. In addition to highlighting improved system wide access, a new rollout solder pot design, and an advanced control system, the VectraElite on display at this years show will feature numerous advanced technologies available only from Speedline Technologies.
Examples include its UltraFill(TM) nozzles, upper High Velocity
Convection (HVC) preheat module and its revolutionary ServoJet(TM) fluxing system. Speedline will also preview its new Post Wave Cooling (PWC) module and the Optima ultrasonic spray fluxing system featuring Ultra-Spray┬«: technology. Collectively, these and other advanced technologies specifically designed for today's lead-free wave soldering process demonstrate Speedline's continued wave soldering process and technology leadership.
Speedline will also preview a host of exciting new options for its revolutionary MPM Accela printing system as well as spotlight an array of its best-in-class MPM printing, Camalot dispensing, and Electrovert soldering and cleaning solutions at its booth.
all4PCB - Booth 1883
Distributor all4-PCB (North America) will introduce two revolutionary products that will be making their North American trade show debut at APEX.
"With the printed circuit board industry rebounding around the world, it's the perfect time to introduce the best-of-the-best when it comes to internationally manufactured process equipment," says Torsten Reckert, President, all4-PCB, North America. "IPC attendees love getting the hands-on demonstration we provide right on the floor."
The Penta 580 Pb Free HASL (Hot Air Solder Leveling) machine is manufactured by Pentagal in Germany, the most experienced manufacturer of HASL equipment in Europe. This groundbreaking technology is uniquely designed to conform to the ban on lead soldering equipment scheduled to go into effect throughout Europe in 2006. In addition, IPC marks the introduction of the PRS 77 optical lay-up, registration & bonding system for preparation of lamination stacks, from DIS in New York. This novel process greatly increases layer-to-layer registration over current solutions.
In addition to the above introductions, all4PCB will also be demonstrating the novel PM 650 orbital sanding machine for via fill technology from Pola & Massa. The ability to conform to uneven surfaces now allows for much higher tolerance manufacture. The PM 650 system is complemented by the VCP via filling equipment from MASS Germany, also on display, which provides for filling of pastes into vias through via-in-pad technology. This conductive interconnect to the surface feature of the pad in different board layers takes place in the pad rather than on the surface of the board, thus removing any connective paths on the surface of the circuit board itself.
Bliss Industries - Booth 857
Bliss Industries Inc. will premier its Box Build Line in booth 857 at APEX 2006.
In 2005, Bliss Industries entered the box build arena with the Chassis Cart. Since then, the company has completed the Box Build Line and will display it in its entirety at APEX 2006.
With the completed line, Bliss Industries takes the lead in the box build arena as the only supplier in the industry to provide a complete line of products from the assembled PC board to the assembly process of 19" rackmount chassis, test and chassis installation into 19" racks. Bliss now offers a solution for every step of the process, including handling and storage. The company offers the Adjustable Tray Cart, Vertical PC Board Cart, FlexBench, BlissLift and Chassis Cart. These products combine to make a seamless process from the assembled PC board to the assembled 19" rack.
"These are exciting times at Bliss Industries. We are growing rapidly again and delivering new product lines to the industry to solve problems. The Box Build product line takes Bliss, for the first time, to a new sector of the industry that is not only poorly served in the past, but is not served at all," said President and CEO Ken Bliss. "We are pleased to have been welcomed with open arms into the sector by virtually all of the top system box builders."
HEPCO - Booth 1396
HEPCO, Inc's new LeadHound RoHS/Lead-Free Verification System will verify lead-free or leaded components, sub-assemblies, PCBs and other items in as little as 15 seconds. LeadHound will be introduced at APEX 2006.
Using the latest micro-focus x-ray fluorescence (XRF) technology, the self-contained LeadHound can detect the presence of lead, cadmium, mercury, chromium and bromine, as well as other elements, in a safe working environment and provide the percentage of each element found in a tested item. This enables shops to determine if an item complies with RoHS/WEEE directives or if soldering materials or components comply with military and avionics specifications.
"XRF is a proven non-invasive, non-destructive technique that is being adapted to the electronics industry and the manufacturing/repair environment," said Tim Hoffman, president, HEPCO. "LeadHound can test several items in one session and typically generate a report for most requirements in 30 seconds. It can take as little as 15 seconds. This is still a far cry from the several days required to send samples to laboratories for analysis. LeadHound generates a report after each test that can be printed or stored as a file to meet all applicable documentation needs. We will be able to add upgrades through software."
"Every facility should be performing some kind of incoming inspection," Hoffman continued. "Lead-free and leaded components need to be kept separate for compliance, and even in basic production needs, they have different temperature requirements for soldering. If a facility doesn't take those into account, its customers and their end-users will have problems down the line."
Nelco - Booth 1409
Nelco is introducing its new N4000-29 180┬░C Tg substrate. This new advanced material system is now available in North America and is planned to be available in Asia and Europe in the first calendar quarter of 2006.
The N4000-29 series of laminate and prepreg materials is designed to provide Nelco's customers with a high Tg, CAF resistant FR4 product for lead-free applications or any application where a high level of thermal robustness is required. N4000-29 also offers CAF resistance, a UL 94V-0 designation, RoHS compliance and superior IST performance. N4000-29 is UL approved. These qualities, along with adherence to IPC's proposed IPC-4101/99 lead-free "slash sheet", make N4000-29 a very suitable choice for lead free or high reliability applications
Nelco is a subsidiary of Park Electrochemical Corp., a global advanced materials company which develops and manufactures high-technology digital and RF/microwave printed circuit materials and advanced composite materials for the electronics, military, aerospace, wireless communication, specialty and industrial markets.
P. Kay Metal - Booth 2635
P. Kay Metal, Inc. will introduce its new MS2(TM) molten solder surfactant in Booth 2635 at the upcoming APEX 2006 trade show and exhibition.
MS2(TM) molten solder surfactant is described as the first product to actually eliminate dross in wave soldering. The material, which is available for both lead-free and leaded processes, does not mix with the metal but forms a thin floating layer that covers the entire solder surface except the wave, which it does not disturb. MS2(TM) molten solder surfactant prevents dross from forming on the surface and immediately converts dross generated by the wave back into usable metal, reducing solder usage up to 70%.
In conjunction with the product introduction, Dan Feinberg of Fein-Line Associates, who is working with Larry Kay, president of P. Kay Metal, to develop the business, will deliver a technical conference paper, "A Unique Process that Eliminates Solder Dross," in Session S11, Equipment I - Lead Free, on Thursday, February 9, 9:30 AM-10:00 AM.
Tyco Electronics - Booth 1029
Tyco Electronics' Global Application Tooling Division (GATD) will exhibit the P350 Pin Inserter at the upcoming APEX trade show and exhibition.
The P350 is a high-speed, automatic insertion machine. The system can apply nearly all manufacturers' reeled pin, tab and receptacle products into PCBs and is capable of applying both through-hole solder and press-fit components. Insertion rates of up to five cycles per second are possible based on the pitch of the product applied to the PCB.
The P350 insertion machine offers many features, including: high-speed AC servo motors for the X-Y table and insertion head for reduced cycle times; automatic tool change feature for up to three insertion heads; SMEMA compatibility; optional optical sensors for automatic position correction; optional PCB thickness measurement; rotary insertion finger to apply products at various angles without reducing cycle time; monitoring of the insertion forces of press-fit components to provide 100 percent real-time quality inspection; and a maximum insertion area of 450 x 450 mm. The system features 0.02 mm repeatability.
Tyco Electronics' will also showcase its CSM 200 Connector Seating Machine. CSM 200 is a semiautomatic machine for the application of compliant pin connectors. The environmentally conscious system provides end users with a faster, more reliable and less operator-intensive method for processing this lead-free product.
In addition, the company will exhibit the MEP 6T servo electric press. The MEP 6T is a servo electric press specializing in the application of compliant pin connectors to PCBs. The environmentally conscious system provides end users with a faster, more reliable and less operator-intensive method for processing this lead-free product.
The MEP 6T provides up to 6 tons of pressing capacity and can accommodate PCBs up to 24 x 36". The 10" wide press ram also allows for the mass-termination of more than one connector (of the same type) in a single press stroke to improve cycle time.
Ultrasonic Systems - Booth 735
Ultrasonic Systems, Inc. will demonstrate a conformal coating production line at Apex.
This automated line will begin coating the bottom-side (wire side) with a Prism 100, designed for high-speed coating. The board will then pass through a board inverter to a Prism 350 and be selectively coated on the component side.
The Prism Coating Systems are designed for the precise application of conformal coatings and other low-viscosity materials. The Prism features patented Ultra-Spray technology, which enables a more accurate, precise coating application than conventional spray and dispensing technology.
The Prism utilizes a titanium coating head and digitally controlled liquid delivery system. The coating head applies a thin, defect free coating 1 to 5 mils in thickness and provides excellent uniformity and repeatability.
AkroMetrix - Booth 1451
AkroMetrix, LLC, will have two pieces of equipment on display: the redesigned TherMoire PS200 and the production-level LineMoire PS16.
The latest TherMoire PS200 lab tool is the direct result of customer feedback and changing industry needs. The new JEDEC standard for temperature-dependent warpage measurement of packages (JESD22B112) now requires faster heating and cooling rates, and the new PS200 delivers dramatic improvements in both. This allows the user to more precisely replicate a temperature profile, all while taking real-time flatness measurements. Also, its new ergonomic design and better user interface improve ease-of-use.
The LineMoire PS16 is a room-temperature flatness measurement system, designed for both QA/QC and high-volume production settings. The PS16 is capable of both package and PCB flatness measurements. The key strength of the system is the ability to measure global and local area warpage with a 1 second data acquisition time.
ASYS Automation - Booth 341
ASYS will introduce a new laser marking island at APEX 2006.
The island consists of a Board Destacker, Laser Marker, an optional Flip Station and a Restacker. This island can handle a throughput of up to 510 PCBs per hour including code verification.
The optional Flip Station, which is completely controlled by the laser marker, can flip the boards for double sided marking requirements. The marker can handle all industry standard 1D and 2D codes, text and graphics in a maximum range of 18" x 18". The island is less than 8 1/2 feet long and can be upgraded with multiple options.
For more information visit www.asys-llc.com
Bliss Industries - Booth 857
Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, will be exhibiting many new products and services at APEX.
Bliss will exhibit from its largest booth, and will have its entire product line on display, featuring more than 14 different lines. The stars of Bliss's show will be the new BlissLift and chassis cart. Be sure to stop by the booth for a better look at these. Also, Bliss has recently entered the box build sector of the electronics assembly industry with an entire line of products that can be seen at APEX.
"We have once again standardized an industry," said Ken Bliss President and CEO Bliss Industries. "Bliss standardized the PC board assembly industry and now has done the same for the box build sector. This is the most complete line from one source. We listened carefully to key industry OEM customers like HP, IBM and Dot Hill along with top EMS customers like Benchmark, Plexus and Sanmina-SCI to get it right," Bliss continued. "They told us what they wanted and we delivered. You must see this line of products if you are in PC board assembly or box build. Let us show you how we can solve your problems."
SMT Detergent Corp. - Booth 1290
SMT Detergent Corp. will demonstrate solder paste cleaning from stencils, misprinted PCBs and pallets used in SMT assembly of PCBs.
Lead free solder paste will be cleaned from ultra fine-pitch stencils using 440-R SMT Detergent in a standard ultrasonic stencil cleaner and in a manual cleaning application.
440-R SMT Detergent is a non-hazardous, environmentally safe and user friendly water-based detergent that cleans faster and more effectively than VOC solvents.
440-R SMT Detergent is the only cleaning chemistry verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA's Environmental Technology Verification Program and certified environmentally safe and user safe by California's Environmental Protection Agency, yet it is guaranteed to clean any type of solder paste from any fine-pitch stencil.
This is important if the assembler needs to use multiple solder pastes or plans to change solder pastes in the future as 440-R SMT Detergent will support the change and not require a new chemistry, equipment or waste management protocol. A practical method to completely eliminate the task of liquid hazardous waste disposal will also be presented.
Speedprint Technology Ltd., a division of Blakell Europlacer Group, will showcase the SPRINTavi Automatic Inline Stencil Printer in Hilton Room 13 at the upcoming APEX 2006 trade show and exhibition.
The SPRINTavi Automatic Inline Stencil Printer provides exceptional functionality and numerous standard features that maximize both speed and throughput rates. Designed for fine-pitch applications, this flexible printer combines high build quality and many advanced features generally only found on more expensive machines, providing significant cost benefits to users.
The precision-machined print head features closed-loop squeegee control and fully programmable print parameters. The patented "look down - look down" camera alignment system not only provides 6 sigma alignment repeatability but also gives the printer the facility to inspect the on-stencil paste and automatically dispense new paste in the appropriate position.
The innovative camera alignment system ensures 6 sigma repeatability as well as numerous additional benefits, such as a full range of options, an advanced control system that contributes to low cost of ownership, and an over-stencil camera that provides in-process auto paste inspect.
A wide range of options is available for the Sprint. These include a fully programmable paste dispenser, powered rail PCB width adjust, SPC data logging software, VacuNest tooling, laser tooling with Gerber import utility, 2D+ paste inspection with bridge detection and Gerber import utility, 2-D solder paste inspection, squeegee assemblies (per pair: sizes 170 to 320 mm and 370 to 490 mm), Siemens Upline interface, and Siemens Downline interface.
Tyco Elecronics - Booth 1029
Tyco Electronics' Global Application Tooling Division (GATD) will highlight its unique, award winning line of reel-to-reel RFID inlay assembly systems.
This RFID line is an industry first since it is an entire line of flexible systems. The system features many characteristics, including throughput up to 9,000 cph, a full 20" wide web process capability, a placement system that has 12 ├»??m repeatability at - 3 sigma, and much more.
In addition, user benefits are high; processing either passive or active inlay designs, direct die pick from wafer down to 0.008", and utilization of a patented positive displacement pump technology. The reel-to-reel RFID inlay assembly system also features a modular construction, allowing for future capacity expansion, or changes in the assembly process. It is fully capable of placing ancillary components such as batteries, and it also is capable of tape-and-reel die placement.
Tyco will also display the Harmony-SPX for high-volume selective soldering. The Harmony SPX Selective Soldering System is a multi-axis Cartesian Robot designed specifically to selectively solder through-hole and odd-form components into surface-mount and mixed-technology printed circuit boards (PCB).
The Harmony-SPX module conforms to SMEMA in-line manufacturing standards and is ideally suited for applications where the product is manufactured in small or large lot quantities and a high product mix. The conveyor system is intrinsic to the robot expanding between 4-18" under program control. The rotation and tilt axis are built into the conveyor head. The conveyor will line up and receive an incoming PCB locating it in position.