Photo Stencil to present papers at APEX
Jan 11, 2006
Photo Stencil, a leading provider of premium stencils and additional high-end tooling for the SMT assembly industry, will present two papers at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit. The conference is in Anaheim, California, February 8-10, 2006.
Dr. Bill Coleman, vice president of technology, will present 'Step Stencils', a discussion of the new technologies required by a more demanding SMT environment. Thick metal stencils, electroform step-up stencils and special 3-D electroform stencils are some of the solutions that have recently evolved. These applications, as well as the stencil design to achieve an optimum solution will be discussed in detail in this paper on Wednesday, February 8 from 1:30pm-3:00pm.
Mike Burgess, stencil product manager, will present the second paper on lead-free in the SMT industry. Entitled 'Lead-Free Solder Paste Printing: Stencil and Squeegee Blade Impact', this study will focus on the stencil and squeegee blade and their impact on the lead-free solder paste-printing process. Three different stencils, three different lead-free solder pastes and five different squeegee blades are included in the overview. The discussion will be on Thursday, February 9 from 1:30pm-3:00pm.
Photo Stencil will be exhibiting at the conference at booth 801. Coleman and Burgess will both be available at the booth to answer questions or for in-depth technical discussions.
Please visit http://www.photostencil.com/apex for access to both papers and to register for a free VIP pass to the APEX conference.