Practical Components adds Amkor's PoP packages to dummy components line
Jan 13, 2006
Leading international distributor of mechanical IC samples, and SMD production tools and equipment, Practical Components has announced that it has introduced Amkor Technology's award winning package on package (PoP) family of mating bottom and top daisy chain components to its extensive line of dummy components.
Package on Package (PoP) stacks are designed for portable products requiring integration of high-density logic plus combination memory devices. Amkor's PoP daisy chain components are compatible with JEDEC specifications to ensure electrical and mechanical mating of top to bottom packages.
System designers for portable electronic products such as mobile phones, digital cameras, PDAs, portable players, gaming and other multimedia applications are increasingly specifying PoP stacks to solve the size and cost impacts associated with high levels of functional integration
Per Lee Smith of Amkor said, "In addition to JEDEC specifications the availability of standard PoP daisy chain samples through Practical Components worldwide stocking distributor network should facilitate adoption of PoP stacks to a wider range of applications and integrators. This set of standard PoP daisy chain components will enable more cost effective development and qualification of the surface mount stacking processes as well as finished board level component reliability testing, critical in handheld electronics."
Kevin Laphen, president of Practical Components, said, "Leading original design and manufacture (ODM) and electronic manufacturing service (EMS) providers increasingly look to dummy components to develop, qualify and monitor their advanced assembly processes."