IRC partners with Chip Supply to distribute wire bondable resistor die
Jan 23, 2006
TT electronics IRC Advanced Film Division has added Chip Supply, Inc. as a die distributor for its wire bondable chips. Designated the WBC Series, the resistors feature IRC's self-passivating TaNSil tantalum nitride thin film technology on silicon substrates.
"This partnership enables us to provide our products to customers from organizations of all sizes throughout the world," said Steve Wade, Director of Sales and Marketing for IRC Advanced Film Division. "As the largest die distributor in the world, Chip Supply, Inc. has the specialized experience needed to provide superior technical service for our wire bondable resistor die products."
Located in Orlando, Florida, Chip Supply, Inc. has a facility comprised of two clean rooms and five buildings of processing space. Chip Supply, Inc. will distribute IRC's WBC Series product to all markets, including aerospace, military, medical, computer, networking, wireless, commercial and industrial.
For more information on the IRC-Chip Supply, Inc. partnership or IRC's WBC Series resistors, visit the IRC Web site at www.irctt.com.