Indium Corporation offers new low-cost evaluation kit
Jan 23, 2006
The Indium Corporation and Practical Components have announced a new low-cost test kit for lead-free assembly.
The new PCB049 board and kit is the ultimate resource for evaluating mixed-technology lead-free assembly. This "do everything" kit allows companies to test a wide variety of JEDEC and EIAJ components.
The PCB049 Board offers users numerous benefits and is used to evaluate solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance, and wave flux hole fill performance. Additionally, the board helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors, and lead-free underfill performance.
The PC049PC Board itself is available in four different optional finishes for 8 x 10" boards: OSP, ImSn, ImAg and ENIG.
Each Practical Components test kit includes a copy of CircuitCAM and CheckPoint software, ready-to-run CircuitCAM project files (CPFs), assembly documentation samples and templates, installation instructions, and user manual. Additionally, technical support engineers are available to answer questions regarding evaluation techniques and material performance requirements via e-mail at email@example.com or calling 1-800-4-INDIUM.
For more information, visit www.indium.com