APEX2006 product preview - part one
Jan 17, 2006
Here are some of the products being showcased at APEX in just over two weeks, listed is alphabetical order by company name.
If you would like your product release included in the next APEX product preview, send you information by email to email@example.com
Asahi America - booth 1898
Asahi Technologies America will be showcasing Asahi Solder, a high-quality and high-performance line of lead-free solder materials.
Asahi Solder is certified under ISO 14000, 9001, 9002, 9003 for its commitment to the Green environment and quality. The company serves OEMs and EMSs by providing a full range of high-performance and high-quality materials. Above and beyond a material supplier, the company assists their customers in competitive direction by mitigating manufacturing disruptions and disadvantages by offering the 'Drop-in' solutions to lead-free production in the established SMT infrastructure.
Headquartered in U.S.A. and Singapore, the production and service facilities are strategically located in key regions throughout the world.
For more information, contact Asahi America, Inc. at Office@AsahiTech-USA.com
BP Microsystems to highlight 4710 with 2D vision inspection option - booth 369
BP Micro will display its latest automated option, which detects lead defects by integrating a 2D vision inspection system. The 2D vision inspection system, compatible with a high-speed camera, verifies all leads are within some tolerance before the chips are shipped to the customer. The vision system detects edge pitch, which identifies skewed leads at 0.02 mm accuracy and trend edge position, which identifies lifted leads at 0.04mm accuracy.
Used on BP Micro's automated programming systems, the 2D vision system mounts onto a tape loader and integrates with BP Win and Jobmaster. The 2D vision inspection system will be demonstrated on the 4710 automated system.
The 4710 is designed specifically for today's highest density devices and their longer programming times, making it the fastest at programming Flash, while still offering the versatility to program Microcontrollers, FPGAs, PLDs and all other device types.
The 4710 offers users numerous benefits, including:
-- The fastest programming times and unrivaled throughput means lower cost-per-device
-- Supports device densities up to 4 Gbits
-- Uses USB 2.0 communications bus
-- Programs at an unsurpassed 0.24 s/Mb
-- Programs up to 1,200 devices per hour
Creative Automation to display Champion 6809 - booth 279
Champion 6809 is a servo-driven, automated dispensing system designed for precision processes. Featuring powerful, easy-to-use proprietary software and a graphics user interface that allows for intuitive programming and control, this system can be used by even an entry-level employee, and it includes a large, bright, high-contrast color TFT display. Additionally, the Champion 6809 can be configured to match exacting application requirements from dots to underfills with a broad array of options. Placement accuarcy of this system is within 3 √É???m, but features placement capabilities that are designed for anticpated accuracy demands that have not yet occurred.
The Digital Dispensing process achieves the highest levels of accuracy, speed and repeatability available today. Made for nanodispensing, the Champion 6809 dispenses dot diameters down to 0.003" with bead width down to 0.003" as well. Volumes are below 0.5 nanoliters. Additionally, the system features a dispense area of 5.5 x 12.0", and a resolution and repeatability of +/-0.00008" (2 µm) for all axis. The closest competitor in this market can dispense at only 1/10 of the prescision of this machine. This machine has solved many of the requirements found in the medical electronics sector that require exacting specifications.
Everett Charles Technologies to showcase Eliminator 6 at APEX 2006
A pre-screener, or turbo charger of sorts, for industry accepted flying probe test (FPT) systems, the test system eliminates test points needing to be tested by FPT. E6 leverages FPT advantages of fixtureless, quick test preparation and programming, while overcoming FPT's historical weakness - slow test times per PCB - to make FPT (as part of the Eliminator Test Cell) suitable for high-volume production electrical test, as well as prototype and all volumes in between. Panel test application niches addressed by the E6 are rigid PCB, I/C package, and PCB inner layers (in development), making the E6 a versatile test tool.
Eliminator 6 scans PCB panels at a rate of up to 76.2 mm (3")/second regardless of PCB density, test pad size and pitch, or number of PCB images per panel, providing users with improved speed and throughput rates. Typical resulting elimination rates of 85-92 percent per panel permits FPT test times of less than 2 minutes per panel. For example, a specific I/C package panel tested on an atg A6/16 FPT took 70 minutes and 16 seconds. After the E6 eliminations, that same panel tested complete in 15 minutes and 21 seconds. This equates to a 78 percent reduction in FPT test time and still with no test tooling cost.
E6 provides numerous cost benefits, the most significant savings being the elimination of expensive test tooling and fixturing, especially for the most complex circuits. This savings includes the specific fixture material cost, assembly direct labor, related overhead and storage expenses associated with fixture tools. On a prober centric test floor, one Eliminator effectively increases the throughput for each of several FPT by 3 to 4X. This significantly increases test capacity with a minimum of capital outlay.
KIC to showcase lead-free thermal process kit - booth 363
The kit is comprised of the SlimKIC 2000, Auto-Focus oven recipe search engine, metal shield, higher temperature thermocouples (TCs) and aluminum tape. The new kit enables manufacturers to set up and manage their lead-free thermal processes.
The brand new metal thermal shield offers significantly better thermal protection while keeping the slim physical dimension of the "cool touch" shield. Some manufacturers process their parts in an inert atmosphere, requiring a tighter tunnel height. A low height thermal shield becomes imperative for such applications. The KIC Auto-Focus acts as an "oven recipe search engine" and automatically recommends the appropriate oven recipe for any lead-free application before even running a profile.
Medium-temperature TCs rated to 400oC as well as aluminum tape for easy TC attachment round off this specialty kit.
Kyzen to highlight A4615 - booth 1401
A4615 is a low VOC aqueous blend designed for optimum effectiveness on pastes, tacky fluxes, rosin flux, no-clean flux, lead-free flux and assembly residues while being people-safe and environmentally friendly.
The concentrated cleaner contains a blend of organic solvents, non-ionic surfactants, alkalinity builders, and organic and inorganic inhibitors in a water base. It can be used in spray-in-air inline and batch washers, immersion agitation, or ultrasonic systems. It also may be used in stencil cleaning systems or manual applications for the removal of virtually all types of pastes and fluxes.
A4615 is the only SCAQMD approved product that is effective at 25 g/l operating conditions. The material offers users numerous benefits, including brilliant solder joints, low foaming, multi-metal safe, RoHS compliant, no HAPs, non-flammable, low use cost and long bath life.
MVP to highlight wire bond inspection capabilities - booth 2493
MVP is expanding its current capabilities to include the application of wire bond. "We are very excited to offer this new affordable option of wire bond automated optical inspection by leveraging the same capabilities and tools offered by our standard MVP AOI software," said Dr. George Ayoub, President and CEO of MVP. "This will expand our product line beyond component assembly and paste inspection, enabling MVP to offer a competitive product for the packaging industry."
Defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry, and contamination can easily be detected using the wire bond inspection configuration.
The wire bond configuration is available as an option on MVP systems. For more information, contact the company at (760) 438-1138 or firstname.lastname@example.org.
Promation to Exhibit PRO 1S and PRO 1Sm Mini Wave Systems - booth 915
The PRO 1S and PRO 1Sm are single nozzle, selective soldering stations that incorporate a variety of technologies to easily solder individual or groups of components. The nozzle is surrounded by a nitrogen blanket to enhance the soldering process.
The 30 lb solder pot is lead-free compliant and comes standard with a solder replenishment system and automatic spray fluxer system. PCBs or pallets enter the work cell on a precision in-line conveyor system. Programs may be easily set up through the use of Promation's data management system or overhead laser pointer. Once the X/Y parameters are established, the Z motion may be used to maneuver around bottom side components. For more information about the PRO 1S please contact your local sales representative.
Surclean to highlight SMT USC400
The SMT USC400 is a highly portable ultrasonic contact type stencil cleaning system. In use, the operator moves the hand tool over the stencil after spraying with cleaning fluid. The tranducer in the hand tool vibrates the contamination through even the smallest stencil apertures. The residues are collected on disposable wipe material under the stencil. The SMT USC400 excels in removing difficult high tack residues such as those found with lead-free solder materials. Direct contact ultrasonic cleaning is the most effective way to remove lead-free solder paste residues from fine-pitch stencils.
The SMT USC400 is suitable for both offline and on-printer cleaning operations. Additionally, stencil cleaning can be carried out on the printer without removing the stencil frame. Because the USC400 is highly portable, it can be easily moved between work areas or Printers.
An optional ultrasonic mini-bath is available, which extends the versatility by allowing cleaning of machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
The SMT USC400 offers users numerous benefits, including the following features: lightweight for workplace portability, rugged industrial construction for long service life and is suitable for all stencil materials, even plastic. The systems offers no risk of damage to delicate stencils and is suitable for cleaning all printable materials, including paste, inks, resists and SMD adhesives. Also, an Advanced Transducer Autotuning system results in optimum cleaning performance on all applications.
Further benefits of the SMT USC400 include minimal use of cleaning fluids, lower cost and less VOCs. The system is versatile because it ban be used on- or off-line, and cleans both machine accessories and nozzles. Additionally, the SMT USC400 is portable - users can take the cleaning system to the job.
The SMT USC400 results in improved process yields, particularly on fine-pitch applications. As an optimum stencil cleaning solution for lead-free processes, the system is affordable, offering a low acquisition cost, and offers users simple operation that requires no operator setting. As a further advantage, the system is safe - a low voltage, high-efficiency transducer drive circuitry is standard on the SMT USC400.
Tamura to showcase FLIP - booth 1251
FLIP Solder Bath for Lead-free reflow soldering solutions features Linear Induction Pumping Technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming's left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two Induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in both reflow and selective solder systems, the FLIP is one of its kind.
Additionally, the FLIP Solder Bath features numerous advantages over other solder bath systems, including less solder used: only 300 kg, instead of 450 kg and less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. This results in less waste to eliminate making this device not only environmentally efficient but also saves a significant time saver as well not having to stop the machine as often to empty the dross. This feature also uses one third less solder so a significant cost savings is realized. Also, it offers significant ease of maintenance - Open space to access inside side bath and easier nozzle cleaning and maintenance. Improved machine reliability and up time is realized - No motors, impeller shafts or belts. It also features a quieter and more stable solder wave than impeller motor types. Because of this, the product is safer for the operator to use. Acid oxidization around the motor spindle is eliminated and a quicker response results.
The patent-pending technology offers users multiple advantages, including the following: the solder bath uses 30 percent less initial solder to operate because it features a smaller solder bath than conventional systems; and the solder bath generates 40 percent less solder dross after eight hours of operation than conventional motor-driven solder baths.
VJ Electronix to Highlight Summit 1800A Rework Station at APEX 2006
VJ Electronix's Summit 1800 Rework system provides some of the most advanced features designed specifically to address the most difficult rework challenges, including lead-free rework for large components. An increased 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets and connectors. The addition of programmable, motor-controlled top heater positioning in conjunction with the Summit's independent pick-up motion provides the ultimate in process flexibility, the number one choice for many contract manufacturers.
The Summit 1800A adds a motor controlled board support table to the many standard benefits of the leading lead free rework system. The new table facilities automated, hands free site scavenging. It also supports automated alignment and further reduces operator intervention. Various options are available for the Summit 1800A, which include component print station, cooling boost, sliding board support, 17" LCD monitor and 22 x 30" board size upgrade.
VJ Electronix's Windows-based SierraMate 7.0 software improves on the Summit's industry-proven simple operation and process control. New Advanced Auto Profile with rules-based process development allow process engineers to set specific constraints to be applied during automatic profile generation. This is a significant benefit for lead-free processes.
An automatic prism shuttle designed to accommodate large components facilitates accurate and repeatable component alignment. The system simultaneously looks up at the component and down at the board, providing a composite alignment view. The digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a simple click on the graphical user interface.