Lead-free, no-clean solder pastes to be introduced by Heraeus
Dec 05, 2005
A new, state-of-the-art, lead-free no-clean solder paste that promotes wetting and minimizes defects with tin/silver/copper alloy soldering will be unveiled this spring by the Circuit Materials Division (CMD) of Heraeus.
The new line of solder pastes the F640 Series will be introduced to the microelectronics industry during the annual APEX conference and exposition in Anaheim, California.
With its wide process window, the F640 Series of no-clean solder paste is said to be able to compensate for process variations in printing, component placement and soldering. These lead-free pastes provide industry- leading wetting on a variety of surfaces and finishes and leave behind a clear residue. This reduces processing costs significantly, makes set-up easy and saves time. Offering minimal slumping and exceptional print-to-print consistency, the F640 Series can also be reflowed in air or nitrogen environments.
"The F640 series of solder paste is the latest addition to the wide array of lead-free products offered by Heraeus to the industry," said Brian Bauer, business manager for Surface Mount Materials at Heraeus CMD. "These lead-free, no-clean solder pastes were tested extensively with our customers before being offered to the marketplace. These pastes are capable of providing near defect-free performance in the ever-changing production environment where reduction of hazardous substances (RoHS) and elimination of lead from the manufacturing process are a priority," Bauer added.