Overcoming Problems with Testing and In-System Programming of PCBs with BGAs
Dec 06, 2005
Free booklet describes powerful and proven Boundary-Scan solution
Throughout the electronics industry, manufacturers are turning to the latest device technologies, such as BGAs (ball-grid arrays), chip-scale packages, and other small outlines, to provide the functionality and miniaturization they need. However, the new packaging increases the difficulty of accessing printed circuit boards (PCBs) for testing and on-board device programming.
Industry has addressed these difficult access problems through adoption of the IEEE 1149.1 boundary-scan standard to test and perform in-system programming (ISP) on highdensity PCBs.
While some test engineers are now familiar with the technology, many others will be looking at its possibilities for the first time. Also, designers working with test engineers at the DFT (design-for-test) phase of product development should be aware of the overwhelming benefits of the boundary-scan technology for testing their products.
With these issues in mind, JTAG Technologies has compiled a new 30-page guide to introduce the subject to engineers and managers. The booklet "demystifies" test procedures in general and, more specifically, illustrates the benefits of adopting boundaryscan test and ISP as an integral part of a product's development. The booklet is available now and can be ordered via the website (www.jtag.com) free of charge.