New dam and fill encapsulants from Henkel
Dec 07, 2005
The electronics group of Henkel has announced two new, high-purity dam and fill encapsulants designed specifically for lead-free processing. Hysol FP4451TD and Hysol FP4800 both meet the stringent JEDEC level testing requirements for high-temperature reliability demanded by lead-free processes. The two products enable smaller, thinner and lighter wirebonded cavity down, SuperBGA and Viper BGA packages, while supporting high-throughput, low-cost package assembly processes. Dam heights greater than 1 mm are possible with Hysol FP4451TD, a tall dam flow control barrier recommended for package level applications. It offers superior dispensing and a high aspect of ratio of 0.70 height to width. In addition, its ionic contamination level is lower than earlier-generation products. Based on proven resin chemistry, FP4451TD exhibits excellent chemical resistance and thermal stability. Hysol FP4800 is a liquid encapsulant with excellent adhesion that can withstand solder temperatures up to 260° C after JEDEC level 2 preconditioning. Its excellent flow properties allow it to penetrate fine-pitch wires and deep cavities without entrapping voids. With the addition of FP4451TD and FP4800 to the Hysol lead-free materials set, manufacturers can be confident of having a full range of products, backed by in-depth technical and engineering support, to meet the EU lead-free implementation date of July 2006.
|
