SMT introduces new portable ultrasonic cleaning system
Dec 13, 2005
SMT, a leader in surface mount assembly and reflow systems since 1987, has announced the SMT USC 400, a portable ultrasonic cleaning system. The portable SMT USC 400 Ultrasonic Cleaning system can be taken directly to the stencil printer to clean stencil apertures without the need to reset and calibrate the printer. Alternatively, when the system is off-line, it can be used in conjunction with a bench-mounted or stand-alone stencil cleaning center. The cleaning system features Direct On-Contact Ultrasonic Cleaning, which is the ultimate way to remove lead-free solder paste particles trapped within stencil apertures. SMT USC 400 is said to provide users with numerous benefits, including minimal use of fluids, total aperture penetration, no risk of stencil damage, robust construction, and it can be used with solder paste or SMD adhesives. Additionally, this fully portable cleaner is suitable for both stainless and plastic stencils, and provides an "on printer" cleaning solution that is designed to improve process yields. USC 400 cleans pick-and-place nozzles, dispensing needles and probe test pins, and can soften solder paste. An optional ultrasonic cup with a dwell timer is available for the SMT USC 400.
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