Japanese wafer manufacturers install EVG system
Dec 02, 2002
Recent orders include 300mm SOI bonding system.
EV Group (EVG), manufacturer of MEMS and semiconductor wafer processing equipment has announced the shipment and installation of several EVG850 automated SOI wafer bonding systems to key manufacturing companies in Japan.
EVG believe that SOI technology has tremendous potential to improve the functions of electronic products, and that the EVG850 plays a major role in this by producing the quality SOI substrate material required for advanced chip production.
They hope the Japanese market will use their wafer bonding systems to enter a new era for developing the next generation of chip design.