Annual Pan Pacific Symposium & Exhibit Program announced
Nov 03, 2005
The Annual Pan Pacific Microelectronics Symposium & Exhibit (January 17-19, 2006, at the Hapuna Prince Hotel on the Big Island of Hawaii) promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world. Beginning on Tuesday, the technical program will consist of sessions on Lead-free PWB Finishes, 3D Integration, Lead-free Package Finishes, and Advanced Flip Chip, and a Keynote Presentation, "Prospects and Challenges of Nano-Packaging for Electronic and Bioelectronic Systems", by Rao Tumala, Ph.D., Georgia Institute of Technology. Continuing on Wednesday, the technical program will feature sessions on Thermo-Mechanical Reliability, Materials Deposition: Printing and Jetting, MEMS and Sensor Networks, and Embedded and SiP Packaging, and another Keynote Presentation, "Summary of New England Lead-free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards", by Sammy Shina, Ph.D., University of Massachusetts Lowell. Concluding on Thursday, the technical program will have sessions on Materials and Process Management and Reliability Testing & Failure Analysis. Lunch and coffee breaks throughout, as well as the Welcome Reception on Tuesday and Exhibitor Reception on Wednesday, will be spent with exhibitors. For full details on the SMTA Pan Pacific Microelectronics Symposium & Exhibit, visit the event Web site at http://www.smta.org/pan_pac/index.cfm
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