AEMtec is first in Europe to use copper pillar bumping technology

Design and manufacturing service provider AEMtec has announced that it will use the novel Copper Pillar Bumping technology in the company's manufacturing facility in Berlin.

The new technology was developed by Advanpack Solutions Pte. Ltd. (APS), a Singapore-based specialist for wafer level bumping. Both companies are considering a partnership to cover the whole of Europe.

In search of innovative IC package solutions that meet future technology requirements in terms of improved electrical and thermal performance at an optimized cost-performance ratio, AEMtec met with the Copper Pillar Bumping technology of Advanpack Solutions.

This proprietary flip chip technology uses special copper posts capped with solder instead of the traditional solder ball bumps, resulting in an improved electrical and thermal connection performance, a higher connection density and RoHS compliance. The manufacturing process can be compared to a standard wafer level bumping process and is also interesting from a financial perspective.

"To secure jobs in our German manufacturing site, it is indispensable to meet the increasing technological demands with adequate technologies. We have dealt with innovative flip chip technologies for some time now, and regard Copper Pillar Bumping as ground-breaking solution for diverse applications," said Harald Hanne, AEMtec's Managing Director Technology & Sales.