Global Technology Award for Hover-Davis
Nov 17, 2005
The Semiconductor Feeding Solutions Group of Hover-Davis Inc., a leader in design and manufacturing of component delivery systems for the circuit board assembly industry, announces that it has been awarded a coveted Global Technology Award in the category of Assembly Tools for its DDf Ultra.
As a complement to the DDf, which has been an industry leading die feeding solution for the past four years, the performance of DDf Ultra is optimized around the handling of small flip chips. Upon release, the DDf Ultra is capable of feeding die down to 0.5 mm sq. with a throughput up to 6,000 die/hour - with smaller die sizes and higher throughputs planned.
Roland Heitmann, Vice President of Sales & Marketing, said, "We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a "die shooter" or "flip chip shooter," which is essentially a new class of die assembly solutions. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies."