Productronica product preview - part one
Nov 04, 2005
Here are some of the products being showcased at Productronica in just over a week, listed is alphabetical order by company name.
If you would like your product release included in the next Productronica product preview, send you information by email to firstname.lastname@example.org
Aegis Industrial Software - Booth A4.167
Aegis Industrial Software will showcase its material verification and factory-wide traceability solutions at Productronica 2005.
Aegis will simulate an entire factory from materials input, shop-floor materials control, product tracking, real-time data acquisition for line monitoring with SPC and quality data collection, repair loop and inspection data analysis and reporting through to final integration with total traceability and analytics. To help visitors experience the full impact of real-time shop-floor control, data acquisition and data visibility through quality and traceability reports Aegis is preparing a 'factory office' and a 'factory floor' environment on stand A4.167.
Aegis will show how its integrated web-centric real-time applications ensure risk free production aiding lean manufacturing initiatives, ease work-to compliance standards with fail-safe procedures and rich record-of-assembly reports for serialised products.
For more information, visit www.aiscorp.com
DEK - A4.305
DEK is to launch RTC (Rapid Transit Conveyor), a very high-speed board transport option, at Productronica 2005. The new technology joins DEK's flexible set of performance upgrades that enable reduction and fine-tuning of pre-placement cycle time. RTC delivers a deterministic reduction in core cycle time to just four seconds, allowing customers to accurately predict screen printing throughput when implementing line speed enhancements.
RTC joins a range of enhancements developed by DEK to reduce process overheads, including inspection time and underscreen cleaning. Choosing the most suitable technologies to achieve the speed-up required gives customers even more power to fine-tune the print process to match continuous line-wide speed improvements. Other available tools include Hawkeye(TM high-speed print verification, and Vortex Plus paperless 3-in-1 underscreen cleaning.
RTC uses stepper motor technology to greatly increase the speed at which boards are moved into place ready for imaging, and then passed on to the next downstream process such as component placement. In addition to the new stepper motor technology, RTC also replaces the traditional belt-type board transport medium with a positive retention mechanism acting fore and aft of the board. Unlike the belt this does not depend on friction to retain the board, allowing it to be accelerated rapidly to a high steady-state speed by the stepper motor drive.
For more information, visit www.dek.com
Digitaltest GmbH - Booth A1.365
Digitaltest GmbH will be launching several new products at Productronica. The company has developed a new boundary-scan solution for its MTS range of testers, a 'second generation' flying probe system, a low-cost concurrent test platform and major new features for its C-LINK test development software platform.
The Condor 500 Flying Prober is now available with its unique drive technology via linear motor, which ensures both high speed as well as high accuracy (Fine Pitch). The new platform is now 30% faster, 25% cheaper and comes with integrated Boundary Scan and a unique new 'Soft Landing' tool.
Digitaltest's comprehensive software allows fast test program development directly from CAD data and parts-lists. Off-line simulation, panels and different versions of PC-Boards are also supported. The test electronics allows In-Circuit and Functional Test, Opens Check, Memory Test/and Programming, Boundary-Scan and Vision.
The unique implementation of Boundary-Scan allows the heads and further pins to be driven parallel to Boundary-Scan, which enables an increase in test coverage while reducing the test time. The software is rounded off with an integrated quality management system and paperless repair, statistics and fault coverage reports.
For more information, visit www.digitaltest.de
ESSEMTEC AG - Booth A5.477 / A5.478
ESSEMTEC AG will highlight WS330, a professional wave soldering machine for the production of small and midsize batches.
WS330 is a compact, professional wave soldering machine for small and midsize volumes in standard and lead-free technologies. The solder width of up to 330 mm and the universal transport system allow users to work with a large variety of PCBs. The system also is equipped with a dual-wave technology, allowing both THT and SMT components to be soldered.
The latest technologies, including full convection preheating, spray fluxing system, and composite solder waves and pots for lead-free applications, allow the machine to run economically. The integrated microprocessor control stores up to 80 parameter sets and allows the system to be programmed as typically is only available on large inline systems.
WS330 offers users multiple benefits and features including spray or foam fluxer, fully automatic spray fluxer with automatic length and width detection, inert gas (N2) solder wave, proven composite coating for lead-free applications, easily programmable, compact footprint, infinite variable transport speed, and more.
For more information, visit www.essemtec.com
Europlacer - Booth A4.121
Europlacer has announced that it will display the Xpress 25 flexible high-volume SMT placement system in booth A4.121 at the upcoming Productronica trade show and exhibition.
Xpress 25 is said to bring new vision to modular placement ´éż combining high-speed and fine-pitch capabilities within a remarkably compact footprint. Unlike conventional high-end placers, the twin headed Xpress 25 can place a wide array of devices ranging from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec (25,000 cph equivalent).
Equipped with "smart nozzles" and on the fly vision, Xpress 25 gives users a genuine single machine solution. The flexible placement system features numerous key benefits including a significant protection of investment, intelligent feeder technology, "smart" nozzles and more.
Various options are also available for the system: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Henkel - Booth A3.153
The electronics group of Henkel will exhibit its comprehensive lead-free product range at Productronica.
The display will include Multicore┬« solder paste, flux and wire solutions and Loctite┬« surface mount adhesives - designed to withstand the greater rigors of lead-free wave-soldering while preventing chip loss. In addition, Henkel will exhibit a range of Hysol┬« underfills, dam & fill encapsulants, die attach adhesives and semiconductor molding compounds, all optimised for the elevated lead-free process temperatures.
With the transition to lead-free also fuelling the growing demand for compatible material sets, Henkel will use Productronica 2005 to showcase its renowned capability in this area, covering semiconductor package material compatibility through to board level assembly.
In addition, the Henkel stand will demonstrate how Macromelt┬« low pressure molding technology is ideally formulated for encapsulating fine or fragile circuitry. Henkel's Macromelt polyamide materials provide manufacturers with significant operational flexibility while eliminating the need for casings or enclosures, multiple assembly processes and gasketing or sealing issues.
Hover-Davis - Booth A5.224
Hover-Davis Inc. has announced that it will display the Label Feeder, a reliable, inexpensive, automatic labeler, in booth A5.224 at the upcoming Productronica trade show and exhibition, scheduled to take place November 15 to 18, 2005, at the New Munich Trade Fair Center in Munich, Germany.
The base feeders are reliable and offer electric operation. Additionally, they mount to placement machines like any other feeder. Benefits include that the feeders automatically place labels using existing placement equipment, they are faster and more accurate than hand placement, and they save both time and money.
The Label Module (LMG) is included with all new Hover-Davis Label Presenters. This allows users to quickly and efficiently change label sizes without the need for tools.
The LMG is extremely flexible. The design allows users to purchase one base feeder and multiple modules. This saves the customer money and makes it easier to justify the expense. The modules can be exchanged between all feeders in the Label Presenter series.
The modules are compatible with several machines, including Yamaha, Juki Automation Systems, Fuji, Panasonic, Siemens Dematic, Samsung, Assembleon and Universal Instruments Corp. Additional machine platforms are available.
INGUN - Booth A1.359 / A1.325
This year INGUN will exhibit twice at Productronica: On booth A1.359 the German Test Equipment specialists will present ita large range of Test Probes and Test Fixtures. Numerous new products will be presented, e.g. "soft" Tip-Styles, spring-loaded Tooling Pins, intelligent Push-rods and a compact Marking Unit.
The INGUN Test Systems will then be displayed on the booth A1.325 together with co-operation partner TRI. Here INGUN will present the new generation of the Functional Test System IN 256 MDA FT with numerous new features and a new design.
For more information about INGUN visit www.ingun.com.
KLG Maschinen - Booth B4.241
OptoJet the revolutionary inkjet technology!
A new technology is developed by a European consortium, consisting of KLG Maschinen GmbH (KLG) from Germany, Patterning Technologies Ltd (PTL) from the U.K., and Adeon Technologies BV (Adeon) from the Netherlands. The technology is a combination of InkJet and Direct Imaging in one machine for the application and exposure of liquid photo-imageable etch resist. The unit is built with a set of InkJet print heads who will print the PCB image on the substrate in photo imageable etch resist. A matrix of collimated UV matrix light will immediately follow. Only the exposed parts of the liquid photoresist will polimerize. A plasma unit in the machine will remove unexposed liquid photoresist. The machine will print panel size 24" x 28" and will comply with all data formats used in the Printed Circuit Industry (ODB++, DPF and Gerber-274X).
KLG's newly developed X-ray drilling- and inspection-machine for high precision multilayer production.
Todays requirements on precision, optimum yield and throughput is in aspect of efficiency - one of the biggest challenges in Multilayer fabrication. The newly developed VisionStar from KLG Maschinen GmbH (KLG) offers the multilayer manufacturer high accuracy and excellent economical results. By measuring at up to 4 points and registrating up to 32 layers it is capable to handle all types of laminate materials. Furnished with an integrated loading and unloading unit the throughput of the VisionStar X-ray drilling machine will be up to 6 panels per minute. The heart of the machine is the micro-x-ray-tube from Viscom, with an unlimited lifetime.
LIPPERT-UNIPOL - Booth B4.333
LIPPERT-UNIPOL will present LIPPRITE┬« SUPER CUT ROLLER and LIPPRITE┬« SUPER CUT ROLLER EXTRA at Productronica 2005.
A new synthetic resin treatment has allowed LIPPERT-UNIPOL to develop a range of LIPPRITE┬« SUPER CUT ROLLERs with superior performance under wet conditions. Whatever the operation, a grade of tool is available for the following tasks:
-- Removing residual copper "nodules" after plating (surface preparation prior to lamination)
-- Removal of built-up resin ink spots in SBU process
-- Finishing for BGA process
-- Removing black oxide from IVH and BVH process
A range of tools can be found on the LIPPERT-UNIPOL Stand B4.333 at Productronica in Munich.
For more information, visit http://www.lippert-unipol.com/pcb.pdf
MatriX Technologies - new Booth A1.339
MatriX Technologies (MXT) is an innovative new company specialising in x-ray inspection systems.
It offers complete solutions for industrial applications such as solder joint inspection and the testing of safety-related mechanical and electrical components. MatriX Technologies focuses on the electronics and automotive industries, e.g. specialised applications for assembly production and the inspection of airbag components.
MXT will be introducing its new automatic x-ray inspection platform at Productronica 2005, Munich, in hall A1 / stand 339.
"In recent years, major progress has been made in the area of inspection performance for AOI systems. However, in the case of automatic x-ray inspection there has been little innovation since the year 2000. MatriX Technologies' high-speed AXI line represents a new benchmark. Our goal is to significantly improve test efficiency through the consistent application of new technologies on double-sided PCB assemblies and, above all, to eliminate the problem of time-consuming application programming", says Eckhard Sperschneider, founder and managing director of Matrix Technologies.
For more information, visit www.m-xt.com
Multiline International Europa L.P. - B3.121
The Multiframe MVA is designed and manufactured by mie in Germany. It is a single side and double side exposure frame that can be utilized for imaging innerlayers and outerlayers as well as solder mask. The system is a complete drawer replacement frame with interchangeable glass that easily adapts to most of the existing manual exposure units.
The mie Panel Positioning System (PPS)
3 lead screws are stepper motor driven and controlled via USB. The screws position the transfer plate in X, Y1 and Y2. Two pins on the front edge of the transfer plate connect the PPS to the panel and transfer the movements. The pin positions can customised in diameter and position. The Panel Positioning Systems (PPS) is also used for artwork to artwork alignment.
The mie Camera Positioning System (CPS)
Two USB CCD-Cameras are installed and they can be used in a 2 or 4 target mode for highest possible accuracy in film to film and panel to film alignment. The cameras are adjustable in viewing angle to avoid parallax problems. Two arms are holding each camera whereby 2 shuttles on a linear rail are moving the arms. 2 stepper motors with timing belts control the shuttle position and therefore the position of the cameras. The stepper motors are controlled by USB controllers.
More features of the mie MAV
A Venturi vacuum system is used for holding the lower glass in place and two independent Venturi vacuum systems are used for mounting the top and bottom artwork. Thermal hardened glass is used and the top glass is mounted with brackets, movable in the upper frame.
Last but not least the systems works with a touch screen user interface for a Windows based software with multi language support and PC-Anywhere Host for remote support via modem or TCP/IP.
OK International - Booth A3.542
OK International will introduce two new stainless steel valves to the TS5500 Series Spray Valve family at Productronica 2005.
The TS5540 and the TS5540F spray fine mist of low-viscosity materials such as conformal coating, solvent, oil and grease precisely and consistently for thin-film fluid deposits.
The TS5540 and TS5540F come with a variety of nozzle/cap configurations for spraying different fluid deposit patterns and sizes. The TS5540's three cone-shaped nozzles/caps are for spraying three sizes of circular-shaped deposits. The TS5540F's three fan-shaped nozzles/caps are for spraying three sizes of elliptical-shaped deposits. Both valves have a 70 psi (4.8 bar) activation pressure and handle fluid pressure at a maximum of 100 psi (6.9 bar). Apart from having different size and shape nozzle/cap, TS5540 and TS5540F are identical in their main valve body build.
Orbotech - Booth B3.414
Orbotech will exhibit the following products at Productronica:
The Discovery AOI series is currently the best selling AOI system in the bare printed circuit board (PCB) manufacturing industry. Designed with new SIP Technology(TM), Discovery is said to delivers simple, intelligent and powerful AOI performance that gives users unparalleled AOI results in the critical areas of operational efficiency, AOI throughput and labor cost reduction.
With various models now available, the Discovery series is described as an ideal solution for all production applications including high-volume at over 200 sides per hour at 100 ┬Ám and advanced HDI & BGA production with inspection capabilities down to 35 ┬Ám line/space.
Symbion(TM) P36 AOI system claims to deliver superior performance for volumetric solder paste inspection and measurement. Symbion's unique POP(TM) (Parallel Optical Path) technology features specialized 2-D and 3-D detection techniques to achieve both the highest defect coverage AND ultra-fast speed for complete inspection coverage of all paste deposits on the board.
Featuring field-proven LSO(TM) Technology, the Paragon-8000 Laser Direct Imaging system offers a breakthrough combination of high LDI throughput and registration accuracy for superior imaging results on even the most complex high-density interconnect and packaging PCBs.
Symbion(TM) S36 Post-Reflow AOI system provides top-of-the-line inspection performance for highest productivity and first-pass yield. The system's unique Wiz & Go(TM) operation features a user-friendly graphic wizard interface that dramatically reduces set-up time and operator requirements.
For more information, visit www.orbotech.com
Ormecon - Booth B3.421
Ormecon will exhibit ORGANIC METAL NANOFINISH, a completely new approach for purely organic surface finishes on printed circuit boards.
It is based on the Organic Nanometal Polyaniline. This is a synthetic organic polymer with an electronic transport property like in conventional metals. It has a passivation effect on metals, and significantly suppresses oxidation.
The ORGANIC METAL NANOFINISH produces a thin, uniform and planar surface, supporting also fine-pitch device assembly, with an environmentally friendly product technology.
There is no formic or acetic acid present and hence no odour or other harmful emissions. The process is very easy to handle and offers a broad operating window.
OMN┬« is an environmental-friendly product with a high process security which provides multiple solderability and significantly high temperature stability. Its performance is close to metallic surface finishes.
In addition, Ormecon International has developed a new, superior Immersion Tin process: ORMECON(TM) CSN FF - W. A high performance, whisker-reducing Immersion Tin process. All chemicals used are lead-free and halogen-free.
This innovative and reliable process fulfills the requirements of several implemented OEM whisker reduction specifications. The product is field-proven and used in high volume operations since 2004.
Rogers Corp - Booth B3.509
Rogers Corporation will be showcasing its two new lines of 2L-FCCL adhesiveless, all-polyimide (API) flexible circuit materials for use in cell phone hinge flex, LCD interconnection, and other applications.
Offerings include Rogers R/flex AP 200 material, a single-clad, cast-on type product and Mitsui Chemicals NEOFLEX NFX material, a double-clad, laminated-type product. Both are available in rolls 250mm and 500mm (9.84 inches and 19.68 inches) wide.
The new adhesiveless products are polyimide-based, made by directly bonding polyimide onto adhesion-treated copper foil, without the use of conventional adhesives. Since these laminates are manufactured without the use of adhesives, they are ideally suited for the manufacturing of circuits intended for use in high-density designs, harsh working environments, dynamic flexing applications as well as thin multilayer and rigid-flex circuits. Product features and benefits include:
-- Excellent solder resistance, ideal for lead-free soldering temperatures.
-- Thinner cross-section than laminates with adhesives, allowing smaller bend radius and high cycles in hinged applications.
-- Inherently flame-resistant, halogen-free (green) with a flammability rating of UL 94V-0.
-- Excellent dimensional stability, for use in making fine line flexible circuit designs and assemblies.
Other products to be featured at the show will include Rogers' full range of RT/duroid┬« products as well as R/flex CRYSTAL┬« Flexible Circuit Materials.
SIPLACE - Booth A5.177
The modular SIPLACE platform - which ranges from the SIPLACE Compact Series preferred by the mid-range market to the SIPLACE X-series, which is capable of reliably placing even 01005 components - provides maximum investment protection thanks to lots of accessories and upgrade capabilities such as our flexible dual conveyor and data management tools, will be exhibited at Productronica.
Switching out hardware was yesterday. Today, product changeovers are accomplished more efficiently via software and data management. SIPLACE software is easy to operate and expertly controls and synchronizes machines and lines. It not only maximizes your throughput and machine utilization, it guarantees it and provides critical benefits in terms of productivity, reliability and traceability.
For more information see: www.siplace.com
Specnor - Booth A4.427
Specnor Tecnic will introduce the latest generation of its state-of-the-art Lead-Free Retrofit Kit in booth at Productronica,
The Lead-Free Retrofit Kit offers the ability to upgrade any existing wave soldering machine for lead-free operation in lieu of buying a new machine or replacing the entire solder pot.
Made of all titanium construction, the Lead-Free Retrofit Kit prevents corrosion that is normally associated with surface coated solder pots, pumps and nozzles.
The Lead-Free Retrofit Kit is compatible with all major brands of wave soldering machines and is considerably less expensive than replacing an entire solder pot assembly. The unique feature of the Lead-Free Retrofit Kit is its titanium solder pot liner. The titanium liner can be adapted to any major brand of wave solder machine and eliminates iron and copper dissolution associated with stainless steel or surface coated cast iron solder pots.
For more information, contact email@example.com
Speedprint - Booth A4.121
Speedprint Technology Ltd., a division of Blakell Europlacer Group, announces that its theme for Productronica 2005 will be "KICK THE LEADOUT."
Speedprint will be located in booth A4.121 at the upcoming Productronica trade show and exhibition, scheduled to take place November 15 to 18, 2005, at the New Munich Trade Fair Center in Munich, Germany.
To support this theme, Speedprint will run a World Cup soccer competition during Productronica. There will be a daily competition, with the prize being a replica football kit.
Additionally, there will be a prize drawing on November 18, the final day of the show. The winner will receive a pair of tickets for a match in the 2006 World Cup finals. Germany will host the finals next summer.
For more information on LEADOUT, visit www.smartgroup.org.
More product previews next week...