BGA inspection system makes life easier

No need to reconfigure lenses, and new software option allows for powerful modellingMetcal says it has enhanced the VPI-1000 Optical Inspection System, its benchtop SMT inspection system, with a powerful 3D modelling software option.The system, which captures clear, crisp images of any SMT device or assembly feature including wire bonds, through-holes, J-legs, gull wings, leaded heel fillets, solder paste and adhesive deposits and height measurements, can also inspect BGAs without demanding a cumbersome lens change.Capable of seeing under BGAs and other ultra low profile packages such as CSPs and LGAs, the system’s capabilities focus on applications where increasingly smaller tolerances, diminishing board real estate and lower device profiles are required, such as the mobile phone and medical device markets.Another new feature on Metcal's VPI-1000 Optical Inspection System is a powerful modelling and analysis software option that allows users to take a 3D image of a solder ball to inspect the surface texture for evidence of surface defects such as stress cracking. The image can be rotated 360° on-screen and is based on the intensity spectrum of reflected light shone onto the solder ball. As such, the 3D modelling capability can be used to quickly and easily establish whether there is stress cracking, and if so, whether or not it is simply cosmetic (and can be safely left) or serious (a structural defect).Central to the system’s capabilities is Metcal's articulating lens, which rotates 90° for easier inspection of interior rows and features an angle swing of 5° (up/down) for closer inspection of top and bottom connections. Source: PCBnewsline