Technical paper submissions wanted for 12th Lead Free Conference
Nov 16, 2005
With the clock ticking and just months to go before the RoHS (Restriction of Hazardous Substances) compliance deadline, IPC and JEDEC - the Solid State Technology Association are announcing the 12th International Conference on Lead Free Electronic Components and Assemblies. The conference will be held March 6-8, 2006, in Santa Clara, Calif. Paper Submissions
Papers from environmental managers and technical staff are sought on any relevant subjects, including: Policy development policy - European lead ban status
-- European/Chinese/other legislation or voluntary activity on hazardous materials and recycling
-- Legislative compliance and policy enforcement methods, etc.
Supply chain issues
-- Standards for marking and testing
-- Materials declarations, part numbers, obsolescence, etc.
Production issues
-- Design for lead free production
-- Components, solder, board developments, availability and lead free compatibility
-- Examples of implementation
-- Reflow, wave, hand soldering, inspection, repair, rework and test, etc.
Reliability issues
-- Tin whiskers
-- High reliability product sectors (automotive, aerospace, etc.)
-- Reliability test data and method developments
Environmental considerations
-- Toxicity and risk
-- Recycling
-- Hazardous substance substitutes
-- Research consortia news and updates
The conference offers time slots between 30-45 minutes long. Some papers may be grouped together in a forum or panel discussion. To submit a 200-300 word abstract, along with a brief biography, send the information via e-mail to LFConf@ipc.org by December 6, 2005.
Presentation materials and papers must be non-commercial in nature, focusing on technology rather than on a company's product. It is mandatory to provide a print-quality paper or hard copies of visuals to be published in the conference proceedings. If your paper is accepted, the deadline for presentation and/or paper submission is February 10, 2006.
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