Kester introduces new solder pastes
Apr 03, 2003
Northrop Grumman Corporation’s Kester business unit has introduced two new solder paste products, HydroMark 531 water-soluble solder paste and PureMark 202 no-clean solder paste. HydroMark 531 was introduced in response to the market’s increasing demand for an all-purpose, reliably consistent water-soluble solder paste that provides hours of stable stencil life, tack time and printing characteristics.Kester claims PureMark 202 is the first all-purpose, no-clean solder paste with printing capabilities to ultrafine pitch, CSP and 0201 component locations.Source: PCBnewsline
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