Speedline Technologies to debut OmniFlex 10 at Productronica 2005
Oct 24, 2005
Speedline Technologies, Inc., will launch its new OmniFlex 10 reflow soldering system as it showcases its most technologically advanced and innovative solutions for the SMT industry at Germany's Productronica 2005 in November at booth number A4-250.
Speedline's new OmniFlex 10 reflow oven redefines the meaning of value leadership in the world of reflow soldering equipment. Featuring advanced heating and cooling transfer technologies, energy efficient design concepts, and reduced maintenance requirements, the OmniFlex 10 "welcomes" the lead-free conversion.
Speedline will also mark the European launch of its new XyflexPro+ dispensing platform and spotlight its recently released next-generation Accela stencil printer at Productronica.
The new XyflexPro+ dispensing platform redefines the boundaries of dispensing equipment capability by delivering an increased speed rating of more than 30% and twice the accuracy of other dispensing systems. The XyflexPro+ features an advanced composite gantry design structure and linear drive system utilizing the latest in motion control drive technology.
The MPM Accela printing system is said to bring a revolutionary new design and theory of operation to the industry. The Accela's innovative parallel processing technology is refocusing the measurement of printer performance from base cycle time to total throughput - a much more important criteria for manufacturers requiring high volume throughput with high yield performance.
"Together, the three solutions represent the absolute pinnacle of technology and innovation - delivering unprecedented benefits in functionality, speed and accuracy for electronics manufacturers," said J√ľrgen Spahn, Vice President, European Operations, Speedline Technologies.
Speedline will host solution demonstrations in its booth, number A4-250, throughout Productronica 2005, 15-18 November, in Munich.