CPPI jumps thanks to DRAM

Northrop Grumman Corporation has announced that Kester, a business unit of the company's Component Technologies sector, has introduced R905, a new lead-free, no-clean solder paste.Kester’s R905 is engineered specifically for the high thermal demands of assembling with the elevated melting temperatures of lead-free alloys such as the tin silver /copper family. R905 is formulated for consistent release from the stencil for critical, fine-pitched applications (0.4 millimeters) with anti-slump characteristics and thepreferred solder deposit definition. These printing characteristics are said to remain constant with print speeds up to six inches per second or 150 millimeters per second. The print quality remains first-rate, even with down times of up to 60 minutes.Source: PCBnewsline