Austin American's Steve Stach and Kyzen's Mike Bixenman to co-present Cleaning Optimization Paper at ATExpo
Sep 08, 2005
Austin American Technology's Steve Stach and Kyzen Corporation's Mike Bixenman will co-present a paper entitled Optimizing Cleaning Energy in Batch and In-Line Cleaning Systems-Phase Two" in technical session SMT2 at Assembly Technology Expo on Tuesday, Sept. 27, from 1:30pm - 3:00pm in Room 5. The session is titled "Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments", Chaired by Tom Borkes, The Jefferson Project and Co-Chaired by Don Swenson, Honeywell.
At the SMTA 2004 tech forum, Stach and Bixenman presented research for optimizing cleaning energy in batch and inline cleaning systems. Phase II of this research tests the process cleaning rate equation, which equals the static cleaning rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) using spray-in-air cleaning equipment. The baseline for this experiment establishes the solubility rate of the cleaning solution, at static conditions, to determine the dissolution rate of flux residue, at a pre-determined cleaning chemistry concentration and temperature.
For more information about the technical conference at ATExpo, visit www.ATExpo.com