Full range of Pb-free materials featured at Indium Corporation exhibit
Sep 12, 2005
Indium Corporation of America will be exhibiting its Pb-free suite of materials at the Assembly Technology Expo in Rosemont, IL on Sept. 26-28, 2005. Indium's exhibit will feature advanced technologies in Pb-Free electronics assembly with cutting edge materials, including Indium5.1, a Pb-Free No-Clean Solder Paste with industry leading "response-to-pause" printing, and NF260, the industry's first Reworkable Pb-Free No-Flow Underfill. In addition, Indium's exhibit will include a full range of PCB assembly materials, including solder pastes, wave solder fluxes, rework materials and solder fabrications, such as solder preforms, solder ribbon and wire, and solder spheres. Indium will be exhibiting at booth #5631. Experts will be readily available at the booth to answer questions on Pb-Free assembly. Articles and information will also be available.
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