AIM to highlight SN100C lead-free alloy at ATExpo
Sep 23, 2005
AIM has announced that it will highlight its lead-free soldering materials, including the SN100C lead-free alloy, in booth 5434 at the upcoming Assembly Technology Expo.
In addition, there will be a live lead-free selective soldering demonstration with the SN100C alloy in booth 5437.
SN100C, created by Nihon Superior in Japan, is a lead-free solder alloy comprised of tin, copper, and a small amount of nickel. SN100C offers user-friendly properties and has been proven in commercial production for over six years.
The small amount of nickel in SN100C modifies its behavior so that in wave soldering the resultant alloy exhibits fluidity comparable with that of the traditional tin-lead solder alloy. The result is that excess solder drains easily off the joint, so that bridges and icicles are avoided. An additional effect of the nickel addition is to provide smooth, bright, well-formed fillets which make inspection easy.
As SN100C does not contain silver or phosphorus, it is less aggressive towards the copper of tracks and pads or the stainless steel components of soldering equipment. These advantages, combined with a low dross rate, mean that SN100C offers substantial savings on the total cost of running a wave solder line as compared to other lead-free solder alloys.
AIM may be contacted at firstname.lastname@example.org, or visit AIM on the web at www.aimsolder.com.