DuPont and Sanmina-SCI sign licensing agreement
Aug 04, 2005
DuPont Electronic Technologies announced an agreement with Sanmina-SCI to become a licensee of Sanmina-SCI's patented Buried Capacitance® technology.
DuPont(TM) Interra(TM) HK polyimide laminates can now be used in the practice of Buried Capacitance® technology, available to Sanmina-SCI's existing family of licensed printed circuit board (PCB) manufacturers. The combination of DuPont(TM) Interra(TM) planar capacitor laminates and the Sanmina-SCI Buried Capacitance® technology enables smaller, more reliable, high-performing electronics.
"We are excited that DuPont Electronic Technologies has licensed our Buried Capacitance® technology," said George Dudnikov, senior vice president and chief technology officer for Sanmina-SCI's PCB and Backplane Divisions. "Buried Capacitance¬ģ technology is an enabler for high-technology printed circuit boards in the telecommunications, high-end computing and military markets. The benefits of using Buried Capacitance® technology can be seen in a variety of areas, particularly in the reduction of high-frequency electromagnetic interface noise and in a quieter power distribution system. Sanmina-SCI continues to develop and invest in leading-edge technologies and this agreement with DuPont Electronic Technologies is one more example of our commitment to the industry."
"We look at this agreement as a winning combination for our customers," said Robert J. O'Connor, global business manager, Embedded Passives, DuPont Electronic Technologies. "DuPont(TM) Interra(TM) HK planar capacitor laminates are easy to use and extremely reliable, which is why they are being rapidly integrated into many large scale, high-end application designs. As we continue to put science to work in developing increasingly thinner and higher capacitance density materials to expand the Interra(TM) embedded passive materials product line, we are pleased to work with technology partners like Sanmina-SCI to contribute to our customers' success."
As designers look to reduce size, improve performance and build more cost-effective electronic devices, they increasingly rely on embedded passive technology, and DuPont Electronic Technologies is creating the broadest portfolio in the world for embedded passive materials under the DuPont(TM) Interra(TM) brand. By combining its strengths in laminates, polymer thick films and ceramic paste materials, DuPont has developed the Interra(TM) embedded passive materials family to include embedded planar capacitor laminates, screen printable polyimide thick film paste products, and ceramic-based screen printable thick film pastes in the broadest range of resistance and capacitance available.
The benefits of using Buried Capacitance® technology can be seen in a variety of areas, particularly in the reduction of high-frequency electromagnetic interface (EMI) noise and in a quieter power distribution system. Even more, Buried Capacitance® potentially reduces many bypass capacitors from the surface of a PCB, which equates to assembly cost reductions along with increasing the available surface area for increased circuit routing density. In support of this, the license offers access to a variety of Buried Capacitance® materials in the 0-4 mil dielectric thickness range, which now includes DuPont(TM) Interra(TM) HK04 and HK 11 polyimide laminates.