Proceedings of Electronics Assembly SSTC Conference now available
Aug 09, 2005
Proceedings of the National Physical Laboratory Summer SSTC Conference are now available.
This Soldering Science & Technology Club meeting, held in July, addressed a wide range of important issues impacting our industry today, from lead-free reliability, use of conductive adhesives, future packaging, manufacturing and processing trends.
The Proceedings include:-
The RoHS - Overview and Update' - James Lingard, DTI
'Effect of Lead Contamination on the Reliability of Lead-Free Solder Joints' - Martin Wickham, NPL
'Suppression of Tin Pest in Lead-Free Solders' - Andrew Nicholson, ZBT on behalf of DKL/Nihon Superior
'PCB Materials Technology for a Lead-Free Environment-Towards a Rapid Implementation for RoHS Compliance' - Martin Morell & Neil Chilton, Circatex
'Trends in Advanced Packaging Technologies' - Andy Longford, Panda Europe
To order the proceedings, priced at £95 + VAT, visit www.npl.co.uk/ei/clubs/050713sstc.html
For more information contact Dr. Chris Hunt firstname.lastname@example.org