Speedline Technologies announces lead-free upgrades
Aug 09, 2005
Speedline Technologies has announced several important lead-free upgrades for its line of Electrovert Wave Soldering Systems for electronics manufacturers.
"The upgrades, which include the new UltraFill Nozzle and Quick Change Solder Pot, deliver powerful new capabilities and productivity improvements to electronics manufacturers seeking efficient and cost-effective solutions in their transition to lead-free operations," said Richard Burke, Speedline Technologies, Product Manager, Electrovert Products.
Forty percent wider than the traditional tin/lead nozzle, the new UltraFill Nozzle is said to increase both contact length and dwell time. The nozzles are placed closer together to reduce the temperature drop between the nozzles - so that less superheat is needed to reflow solder joints in the second wave. As a result, hole fill is improved and bridging is reduced. Moreover, there's no requirement to slow the conveyor and dross generation is reduced. The nozzles are available in Melonite Corrosion Resistant Stainless Steel or Titanium Material designs.
The Quick Change Solder Pot provides the capability to easily switch between two alloys, such as between tin/lead and lead-free solders - for significant labor savings versus a traditional manual changeover. The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and 2 trolleys.
Both upgrades are available as an option on new or existing, installed Electrovert EconoPak Gold, Electra, and Vectra Wave Soldering Systems.
Other upgrades are also available, compatible with a variety of new or installed Electrovert systems. All upgrades are available immediately from Speedline distributors and representatives. For additional information, visit http://www.speedlinetech.com.