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Inari Technology Sdn. Bhd.
Hybrid Packaging & RF testing - wafer prober test, wafer backgrinding, wafer sawing, die attach, wire bond, substrate molding, SMT and box build

    Address/Contact Info
Plot 5, Phase 4, Bayan Lepas Free Industrial Zone
Bayan Lepas,  Penang   11900
Malaysia
Phone: 6-04-6456618
Fax: 6-04-6460618

     

    Description Info

We are a fully Malaysian-own compay that provide electronic manufacturing services to the customers world-wide. Our strength is in Hybrid substrate packaging which combine the fine-pitch SMT, die attach, wire bonding, molding, sawing and testing of substrate-base QFN packaging. We provide wafer prober testing, wafer backgrinding, wafer sawing, wafer inspection and also box-build services.

Listing's Related Category(s):
Services : EMS/Contract Manufacturer

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